Litšoantšo tsa Sehlahisoa
Tlhahisoleseding ya Sehlahiswa
Lintho tse bonahalang
Bolulo: Thermoplastic ea Hing Temperature,
UL94V-0 PBT/LCP,Ntsho/Tsweu.
Kopana le: Copper Alloy C2680.
Shell: Alloy ea koporo C2680/SPCC.
Qetella:
Ikopanye le:Piated Gold In Mating Area;Tin On Solder Talls.
Shell:Nickel Plating.
Motlakase:
Tekanyetso ea Hona joale: 1.5A/Contact Terminal.
Tekanyo ea matla: 30V DC
Khokahano ea ho Kopana: 30mΩ Max.
Dielectric Withstanding Voltage: 500 V AC AT Sea Level.
Khanyetsano ea Insulation: 1000MΩ Min.
Connector Mate le Unmated Force
Matla a Mate: 3.75kgf Max.
Matla a sa Kopanetsoeng: 1.02kgf Min.
Tšireletso ea Terminal: 1.2kgf Min.
E fetileng: 5P B mofuta oa R/A SMD Mini USB sehokelo sokete KLS1-229-5FB E 'ngoe: HONGFA Boholo 29.0×12.7×15.7mm KLS19-HF115F-S