Litšoantšo tsa Sehlahisoa
Tlhahisoleseding ya Sehlahiswa
Lintho tse bonahalang
Bolulo: Thermoplastic ea Hing,
UL94V-0 LCP,Mnyama.
Kopana le: Copper Alloy C2680.
Shell: tšepe
Qetella:
Ikopanye:Piated Khauta Sebakeng sa Mating;
Tin On Solder Talls.
Shell:Nickel Plating.
Motlakase:
Boemo ba Hona joale: 1.0A/Contact Terminal.
Tekanyo ea matla: 30V DC
Khahlano ea ho Kopana: 50mΩ Max.
Dielectric Withstanding Voltage: 300 V AC AT Sea Level.
Khanyetsano ea Insulation: 100MΩ Min.
Connector Mate le Unmated Force
Matla a Mate: 3.0kgf Max.
Matla a sa Kopanetsoeng: 0.7kgf Min.
Tšireletso ea Terminal: 0.5kgf Min.
E fetileng: HONGFA Boholo 29.0×12.7×15.7mm KLS19-HF115F-L E 'ngoe: 5P B mofuta oa R/A dip 180 Mini USB sehokelo sokete KLS1-229-5FK