Litšoantšo tsa Sehlahisoa
Tlhahisoleseding ya Sehlahiswa
Lintho tse bonahalang
Bolulo: Thermoplastic ea Hing Temperature,
UL94V-0 LCP,Mnyama.
Kopana le: Copper Alloy C2680.
Shell: Alloy ea koporo C2680.
Qetella:
Ikopanye le:Piated Gold In Mating Area;Tin On Solder Talls.
Shell:Nickel Plating.
Motlakase:
Boemo ba Hona joale: 1.0A/Contact Terminal.
Tekanyo ea matla: 30V DC
Khahlano ea ho Kopana: 50mΩ Max.
Dielectric Withstanding Voltage: 300 V AC AT Sea Level.
Khanyetsano ea Insulation: 100MΩ Min.
Connector Mate le Unmated Force
Matla a Mate: 3.0kgf Max.
Matla a sa Kopanetsoeng: 0.7kgf Min.
Tšireletso ea Terminal: 0.5kgf Min.
E fetileng: 5P B mofuta oa R/A SMD Mini USB sehokelo sokete KLS1-229-5FN E 'ngoe: HONGFA Boholo 29.0×13×25.5mm KLS19-HF115FP