![]() | ![]() | ||
|
Micro SD 4.0 karete sehokelo push push, H1.3mm Boitsebiso: Insulator: Thermal Plastic, Pated UL94V-0. Mabitso: Phosphor Bronze. Shell: Tšepe e se nang tšepe. Contact Plating: Ka tlaase: 50u"-100u" Nickel Sebaka sa ho ikopanya le: Khauta ea Khauta Sebaka sa mehatla ea solder: 100u"-200u" Tin Motlakase: Matla a sebetsang: 10V Boemo ba Hona joale: 0.5A Min. Khahlano ea ho Kopana: 100mΩ Max. Khahlano ea Insulation: 1000MΩ Dielectric Withstanding Voltage: 500VAC / 1 Motsotso. Mating Cycles:3000 tse kentsoeng |
Karolo No. | Tlhaloso | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nako | Taelo |