![]() | ![]() | ||
|
Micro SD sehokelo push push, H1.85mm, ka CD pin, KHAUTA Boitsebiso: Insulator: Mocheso o Phahameng oa Thermoplastic, LCP, UL94V-0. Kopana le: Copper Alloy T=0.15,Plated 50u" Ni Kakaretso. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell: T = 0.15, Plated 30u" Ni Kakaretso ea metsotso. E kentsoeng 0.5u" Sebaka sa Kopano sa Au Selective. Motlakase: Boemo ba hajoale: 0.5mA AC/DC amx Tekanyetso ea matla: 125V AC/DC Mongobo o Ambient:95% RH Max. Khahlano ea ho Kopana: 100mΩ Max. Khahlano ea Insulation: 1000MΩ Min./500VDC Mating Cycles: 5000 Insertions. Mocheso oa ho sebetsa: -45ºC ~+105ºC |
Karolo No. | Tlhaloso | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nako | Taelo |