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Sehokelo sa karete ea Mid Mount Micro SD push push, H1.0mm, ka phini ea CD Boitsebiso: Insulator: Mocheso o Phahameng oa Thermoplastic, UL94V-0. Kopana le: Copper Alloy, Plated 50u" Ni Kakaretso. Plated Au Selective Contact Area Plated 100u" Sn Over Ni On Solder Area. Shell:Plated 50u "Ni Kakaretso. E hlophisitsoe 1u" Au Selective Contact Area. Motlakase: Boemo ba hajoale: 0.5mA AC/DC amx Tekanyetso ea matla: 125V AC/DC Mongobo o Ambient:95% RH Max. Khahlano ea ho Kopana: 100mΩ Max. Khahlano ea Insulation: 1000MΩ Min./500VDC Mating Cycles:10000 Insertions. Mocheso oa ho sebetsa: -45ºC ~+105ºC |
Karolo No. | Tlhaloso | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nako | Taelo |