Litšoantšo tsa Sehlahisoa Boitsebiso ba Boitsebiso: Bolulo: LCP,UL94V-0,Mnyama. Ikopanye: C5210R-EH, T = 0.20mm Plating: AU 15u "Litšobotsi tsa Motlakase: Matla a Dielectric: AC 300V / Metsotso ea Khahlano ea Insulator: 500MΩ Min Resistance Resistance: 40mΩ Max Mocheso oa Ts'ebetso: -40 ° C ~ 0 Metsotso ea 85 Teko.
XFP Cage 1 × 1 Sehokelo se lekanang le Tobetsa se nang le Heatsink KLS12-XFP-02
Litšoantšo tsa Sehlahisoa Lintlha tsa Tlhahisoleseding ea Sehlahisoa: Ho lumellana le maemo a MSA. Ho ikopanya le tobetsa-ho lumellana ho lumellana le IEC60352. Moralo o khethehileng oa ho boloka bots'epehi ba monyako ho qoba ho sotha sebopeho. Boitsebiso: Cage ea 'mele: Alloy ea koporo e nang le Nickel Plating. Front EMI Gasket: Stainless Steel Front flange:Zinc Alloy Heat sink:Aluninum Heat sink clip:Stainless Steel Upper rear EMI gasket:Conductive Form Lower back EMI gasket: Conducive Elastomer Mechanical: Transceiver Insertion Force:40 N M...
Litšoantšo tsa Sehlahisoa Lintlha tsa Tlhahisoleseding: E khona ho 10Gbps lebelo la pontšo ea data 15 kapa 30-microinch plating ea khauta. Moralo oa lebelo le holimo. Moralo oa SMT ka sephutheloana sa "tape reel kapa tray". Theknoloji e tsoetseng pele ea setempe bakeng sa sefahleho se boreleli. Lintho tse bonahalang: Li-insulators: Polyester Thermoplastics Glass Fiber e Tlatsitse, UL 94V-0 Contact: Copper Alloy With Au Plated. Motlakase: Resistance ea Kopana: △R10 milliohms Max. bakeng sa mabitso a lets'oao la Insulation Resistance: 1000MΩ Min. Boemo ba hajoale: 0.5 Amps ...