Sehokelo sa karete ea Micro SD Mofuta o Hinged,H1.9mm KLS1-TF-017
Lits'oants'o tsa Sehlahisoa Sehokelo sa karete ea Micro SD Mofuta o Hinged,H1.9mm Material: Insulator:Mocheso o Phahameng oa Thermoplastic Flammability Raring,UL94V-0,Black. Ikopanye: Sekoaelo sa Li-alloys tsa Koporo: Sebaka sa Kopano sa Stainless Steel Plating: Gold voer Ni Solder Tail Coplanarity e tlameha ho ba ka hare ho 0.10MAX.
Sehokelo sa karete ea Micro SD push push,H1.4mm, se nang le CD pin KLS1-TF-016
Lits'oants'o tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Micro SD karete push push,H1.4mm, ka CD pin Notes: 1.Coplanarity spec.bakeng sa solder tall le solder pad ke 0.10mm 2. Litšobotsi tsa Motlakase: 2-1.Current Rating:0.5 Amp.max. 2-2.Motlakase: 100V DC max. 2-3.Boemo bo tlase ba ho hanyetsa: 100mΩ Max. 2-4. Dielectric Withstanding Voltage: AC500V rms. 2-5. Insulation Resistance: 1000MΩ Min.(Qetellong)100MΩ Min. Litšobotsi tsa 3.Mechanical: 3-1.Durability:5000 Cycles. 3-2.Mocheso oa ho sebetsa: -45ºC~+105ºC ...
Sehokelo sa karete ea Micro SD, H1.42mm, se nang le CD pin KLS1-TF-015
Tlhahisoleseding ea Sehlahisoa Tlhahisoleseding ea Lihlahisoa Micro SD card connector push pull,H1.42mm, with CD pin Material: Metal shell:Stainless Steel,Nickel general 50u” Housing:Liouid crystal polymer,UL94V-0,Black. Tseba Terminal:Phosphor Bronze.Contact:Gold flash;Solder Mohatla:Gold 1u” Min. Switch Terminal:Phosphor Bronze.Contact:Gold flash;Solder Tail:Gold 1u” Min.
Sehokelo sa karete ea Micro SD push pull,H1.8mm KLS1-TF-014
Tlhahisoleseding ea Tlhahiso ea Tlhahisoleseling ea Sehlahisoa Sehokelo sa karete ea Micro SD karete,Bolelele ba 1.8mm, Roll Pack. Boitsebiso: Bolulo: LCP, UL94V-0,Mnyama. Terminal: Alloy ea Koporo, Khauta e Khethehileng sebakeng sa ho Kopana. Shell:Tšepe ea Motlakase: Tekanyetso ea Motlakase:5V Boemo ba Hona Joale:0.5 A Max. Khahlano ea ho Kopana: 100mΩ Max. Khanyetsano ea Insulation: 1000MΩ Min. Ho mamella Voltage: 500V 1 Motsotso. Durability: 10000 Cycles.
Sehokelo sa karete ea Micro SD push push,H1.4mm, se nang le CD pin KLS1-TF-012
Lits'oants'o tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa karete ea Micro SD push push,H1.4mm,ka CD pin Material: Insulator:High Temperature Thermoplastic,UL94V-0. Terminal: Copper Alloy, Plated 50u "Ni Kakaretso." Sebaka sa Kopano se khethetsoeng kapa se Khethiloeng se entsoe ka 100u "Sn Over Ni On Solder Area. Shell:Plated 50u” Ni Ka kakaretso.
Sehokelo sa Karete e Menyenyane ea SD;Mofuta o Hinged,H1.5mm & H1.8mm KLS1-TF-007
Lits'oants'o tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Karete ea SD ea Micro;Mofuta o Hinged,H1.5mm & H1.8mm Material: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal: Copper Alloy.AU Plating sebakeng sohle sa ho ikopanya le terminal, le tin plating sebakeng sa solder mohatla. Shell: Tšepe e se nang Mokelikeli. Motlakase: Tekanyetso ea Hona Joale: 0.5 A Voltage Rating: 5.0 vrms Insulation Resistance: 1000MΩ Min./500V DC E mamella Voltage: 250V AC Bakeng sa 1 motsotso. Ho Thibela ho Kopana: 100mΩ Max.AT 10mA/20mV Max Mocheso wa Tshebetso: -45ºC~...
Sehokelo sa karete ea Mid Mount Micro SD push push,H1.8mm, inela ka CD pin KLS1-TF-003E
Lintlha tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa Bohareng ba Mount Micro SD sehokelo push push,H1.8mm, inela ka CD pin Material: Bolulo: High Thermoplastic Thermoplastic,UL94V-0,Black. Terminal: Copper Alloy . Shell: Tšepe e se nang tšepe. Khokahano: Sebaka sa Khokahano:Au G/F,Sebaka sa Solder:Matte tin 80u” Min;Ka tlas'a poleiti Ni 30u” Min hohle. CD Pin: Sebaka sa Khokahano: Au G/F, Under plate Ni 30u” Min hohle. Motlakase: Rated current:1.0 A Rated Voltage:30V Contact Resistance50mΩ Max. Insulation Resistance:100...
Sehokelo sa karete ea Micro SD push push,H1.85mm, se nang le CD pin KLS1-TF-003D
Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa karete ea Micro SD push push,H1.85mm, ka CD pin Material: Insulator:Mocheso o Phahameng Thermoplastic,LCP,UL94V-0. Kopana le: Copper Alloy T = 0.15, Plated 50u "Ka Kakaretso." Sebaka sa Kopano se Khethiloeng sa Plated se 30u "-70u" Sn Over Ni On Solder Area. Plated 0.5u” Au Selective ContactArea Motlakase: Tekanyetso ea Hajoale:0.5mA amx Rating Voltage Rating:3.3V Ambient Humidity Range:95% RH Max. Co...
Micro SD sehokelo push push,H1.85mm, ka CD pin,GOLD KLS1-TF-003C
Lits'oants'o tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa karete ea Micro SD push push,H1.85mm,ka CD pin,Gold Material: Insulator:High Temperature Thermoplastic,LCP,UL94V-0. Kopana le: Copper Alloy T = 0.15, Plated 50u "Ka Kakaretso." Sebaka sa Kopano se Khethiloeng sa Plated se 30u "-70u" Sn Over Ni On Solder Area. E entsoe ka 0.5u” Sebaka se Ikhethetsoeng sa Motlakase: Tekanyetso ea hajoale: 0.5mA AC/DC amx Voltage Rating:125V AC/DC Ambient Humidity Ran...
Sehokelo sa karete ea Mid Mount Micro SD push push,H1.8mm, e nang le CD pin KLS1-TF-003A
Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Bohareng ba Mount Micro SD sehokelo push push,H1.8mm,ka CD pin Material: Insulator:High Temperature Thermoplastic,UL94V-0. Kopana le: Copper Alloy ,Plated 50u "Ni Kakaretso." Sebaka sa Kopano se Khethiloeng sa Plated se 100u "Sn Over Ni On Solder Area. Shell:Plated 50u” Ni Kakaretso. Motlakase: Boemo ba Hona Joale: 0.5mA AC/DC amx. Tekanyetso ea Voltage: 125V AC/DC Mongobo oa Ambient: 95% RH Max. Ikopanye le Resi...
Sehokelo sa karete ea Micro SD push push,H1.85mm, se nang le CD pin KLS1-TF-003
Lits'oants'o tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa karete ea Micro SD push push,H1.85mm, ka CD pin Material: Insulator:High Temperature Thermoplastic,UL94V-0. Kopana le: Copper Alloy T = 0.15, Plated 50u "Ka Kakaretso." Sebaka sa Kopano se Khethiloeng sa Plated se 30u "-70u" Sn Over Ni On Solder Area. Plated 0.5u” Au Selective Contact Area Motlakase: Hajoale Rating:0.5 A Voltage Rating:3.3V Ambient Humidity Range:95% RH Max. Contact Re...
Sehokelo sa Karete ea Micro SD; Mofuta o Hinged,H1.9mm KLS1-TF-002
Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Motlakase oa Micro SD; Mofuta oa Hinged, H1.9mm Material: Material ea Bolulo: LCP UL94V-0 Boitsebiso ba Boitsebiso: Sephutheloana sa Tin-Bronze: Theipi le Reel Package Litšobotsi tsa Motlakase: Tekanyo ea Voltage: 100V AC Current Rating: 0.5A (Max1Minu AC) Lekhalo la AC: 0.5A (Max1Minu 0) Letlapa la AC: 20Minu ≥1000ΜΩ Ho kopana le khanyetso: ≤30MΩ Bophelo: ＞5000 Cycles Operating Mocheso: -45ºC~+105ºC
Micro SD sehokelo push push,H1.85mm, Hangata e koaloa KLS1-TF-001B
Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa karete ea Micro SD push push,H1.85mm,Ka tloaelo se koetsoe Boitsebiso: Bolulo: LCP, UL94V-0,Ntsho. Kopana le: Phosphor Bronze. Setšoantšo sa SUS304. Motlakase: Khahlano ea ho Kopana: 100mΩ Max. Dielectric Withstanding Voltage: 500V AC Max e nang le Motsotso o le mong. Khanyetsano ea Insulation: 1000MΩ Min. Boemo ba Hona joale: 0.5mA AC/DC max. Matla a lekantsoeng: 100V RMS Min. Matla a ho Kopana: 13.8N Max. Matla a sa Kopaneng: 13.8N Min. Ikopanye le Resistance Force: 100g Min.Per Pin. Mocheso oa ho sebetsa: -45ºC ~+...
Micro SD sehokelo push push,H1.85mm, Hangata e koaloa KLS1-TF-001
Tlhahisoleseding ea Lihlahisoa tsa Lihlahisoa Micro SD card sehokelo push push,H1.85mm,Hangata e koetsoe Material: Bolulo: High Mocheso Thermoplastic,UL94V-0,Black. Kopana le: Copper Alloy . Shell:Stainless Steel,Nickle. Lever:Stainless Steel,Nickle. Selemo: Pianowire, Nickle. Plating: Underplate:Nickel. Sebaka sa Kopano: Khauta holim'a Nickel. Sebaka sa Solder: Tin holim'a nickel.
Sehokelo sa Karete ea SIM habeli,PUSH PULL,H3.0mm KLS1-SIM2-002A
Lits'oants'o tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Karete ea SIM habeli,PUSH PULL,H3.0mm Boitsebiso: Bolulo:Hi-TEMP Plastic,UL94V-0.Black. Terminal:Copper alloy Shell:Stainless Steel Finish: Terminal:Au E apesitsoe sebakeng seo ho hokahaneng le sona, Tine ea Matte e apesitsoeng holim'a mehatla ea solder e koahetsoeng ka tlas'a nickel Shell:Au E apesitsoe mehatleng ea solder e kentsoeng ka tlas'a nickel Motlakase: Resistance:50mΩ Max Withstanding Voltage 1AC mi350 Voltage AC mi350 ho hanyetsa: 1000MΩ ...
2 Ho 1 Micro SIM & Sehokelo sa Karete ea SD, 8P,H2.26mm KLS1-SIM-109
Litšoantšo tsa Sehlahisoa Boitsebiso ba 2 Ho 1 Micro SIM & SD Card Connector, 8P,H2.26mm Material: Insulator:High Temp Thermoplastic,UL94V-0.Black. Terminal: Copper Alloy,Gold plating in contact area 1u”,Soldering Area gilding 1u” Upper Shell:Stainless Steel,Plate Nickel 50u”.Down Shell:SUS304 R-1/2H T=0.10mm,Plate Nickel 50u”. Motlakase: Matla a Kenyellelitsoeng 1kgf Max. Matla a ho Ncha 0.1kgf Min. Tšireletseho: Li-Cycle tsa SIM 5000, Khahlano ea ho Kopana: Pele u etsa liteko tsa 80mΩ Max, Ka mor'a moo ...
Sehokelo sa Karete ea SIM habeli,PUSH PULL,H3.0mm KLS1-SIM-033
Lits'oants'o tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Karete ea SIM habeli,PUSH PULL,H3.0mm Material: Housing:Hi-Temperature Plastic,UL94V-0.Black. Theminale:Copper Alloy.Gold Flash Plated On All Terminal,LE 50u” Min Nickel e Tlatselitsoe Ka holim'a Allover. Motlakase: Boemo ba Hona Joale: 0.5 A. Voltage Rating:5.0 vrms. Khahlano ea Insulation: 1000MΩ Min.At DC500V DC. Ho mamella Voltage: 250V AC RMS Bakeng sa Motsotso o le mong. Ikopanye...
2 Ho 1 SIM Card +Sehokelo se Senyenyane sa SD,PUSH PULL,H2.7mm KLS1-SIM-024
Litšoantšo tsa Sehlahisoa Boitsebiso ba 2 Ka 1 SIM Card +Micro SD Connector,PUSH PULL,H2.7mm Motlakase: Motlakase: 100V AC Hona joale: 0.5A Max. Khahlano ea ho Kopana: 100mΩ Max. Dielectric tse mamellang Voltage: 500V AC. Khahlano ea Insulation: 1000MΩ Min Mechanical: Matla a ho Tlosa Karete: 13.8N Max. Sututsa ka Matla:19.6N Max. Durability: 10000 Cycles. Thempereichara ea ho Sebelisa: -45ºC~+85ºC Motlakase: Motlakase:100V AC Hajoale:0.5A Max. Khahlano ea ho Kopana: 100mΩ Max. Dielectric Withstanding...
Sehokelo sa Nano SIM Card;PUSH PULL,6Pin,H1.40mm KLS1-SIM-113
Litšoantšo tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Nano SIM Card;PUSH PULL,6Pin,H1.40mm Material: Insulator:LCP,UL94V-0. Ikopanye le:C5210.Plated 50u” Ka Kakaretso,Ikopanye le Bohle Au 1u. Shell:SUS,Plated 50u” Ni Kakaretso,PAD Au 1u. Motlakase: Boemo ba Hona Joale: 0.5A AC/DC max. Tekanyetso ea Voltage: 30V AC/DC Khahlano ea Kopana: 30mΩ Max. Insulation Resistance:1000MΩ Mocheso o Mong oa Ts'ebetso: -45ºC ~+85ºC
Sehokelo sa Nano SIM Card,PUSH PUSH,6Pin,H1.37mm,ka CD Pin KLS1-SIM-066
Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Nano SIM Card Connector,PUSH PUSH,6Pin,H1.37mm, e nang le CD Pin Material: Insulator:High Temperature Thermoplastic,UL94V-0. Kopana le: Copper Alloy, Plated 50u "Ni Kakaretso, PAD Au 1u". Shell:SUS.All Ni 30U/MIN. Motlakase: Tekanyetso ea Hona Joale: 0.5A ampers Voltage Rating:5V AC/DC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./500V DC Mocheso oa ho sebetsa: -45ºC~+85ºC
Sehokelo sa Nano SIM Card,PUSH PUSH,6Pin,H1.25mm,ka CD Pin KLS1-SIM-103
Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Nano SIM Card,PUSH PUSH,6Pin,H1.25mm,ka CD Pin Material: Contact:Copper Alloy.Au over Ni. Bolulo: LCP e Tlatsitseng Khalase. Shell:Stainless.Au holim'a Ni.GND Frame: Copper Alloy.Au holim'a Ni. Phetoho ea ho Khetholla: Copper Alloy.Au holim'a Ni.Slide:Glass e Tlatsitse Pa10t. Selemo: Ha ho na litšila. Hook: Stainless. Motlakase: E lekanyelitsoe hona joale: 0.5A Max Rated Voltage: 30V AC Resistance Resistance: 100mΩ Max. Insulation Resistance: 1000MΩ Min./500VDC Dielectric e mamellang Voltage: 500...
Sehokelo sa Nano SIM Card,Mofuta oa Terei,6Pin,H1.55mm,ka CD Pin KLS1-SIM-104
Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Nano SIM Card, Mofuta oa Tray,6Pin,H1.55mm, ka CD Pin Motlakase: Tekanyetso ea Hona Joale: 1 Amp/Pin.MAX. Motlakase: 30V DC.MAX Maemo a Tlase a Resistance: 30mΩ Max.Qalong. Dielectric Withstanding Voltage: 500V AC MIN. Bakeng sa 1 motsotso. Khahlano ea Insulation: 100MΩ Min.500V DC .Bakeng sa 1 motsotso. Durability: 1500 Cycles. Mocheso oa ho sebetsa: -45ºC ~ +85ºC
Sehokelo sa Nano SIM Card,Mofuta oa Terei,6Pin,H1.5mm,ka CD Pin KLS1-SIM-102
Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Nano SIM Card, Mofuta oa Tray,6Pin,H1.5mm, e nang le CD Pin Motlakase: Tekanyetso ea Hona Joale: 1 Amp/Pin.MAX. Motlakase: 30V DC.MAX Maemo a Tlase a Resistance: 30mΩ Max.Qalong. Dielectric Withstanding Voltage: 500V AC MIN. Bakeng sa 1 motsotso. Khahlano ea Insulation: 100MΩ Min.500V DC .Bakeng sa 1 motsotso. Durability: 1000 Cycles. Mocheso oa ho sebetsa: -45ºC ~ +85ºC
Sehokelo sa Nano SIM Card;MID Mount Tray,6Pin,H1.5mm,e nang le CD Pin KLS1-SIM-100
Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Nano SIM Card;MID Mount Tray mofuta,6Pin,H1.5mm,ka CD Pin Material: Plastics:LCP,UL94V-0.Black. Ikopanye le:C5210 Shell:SUS304 Tray:LCP,UL94V-0.Black. Plating: Contact:Contact Area:G/F Plating;Soldertail Area:80u” Matte Tin Shell:Plating over 30u” Ni Solderable 30u” Ni Plating over all.Tshwara le mohatla coplanarity ho ba 0.10mm kaofela.- English
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