Sehokelo sa Madi Dip 90 USB KLS1-181A
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Bolulo: Thermoplastic ea Hing Temperature,UL94V-0 PBT,Ntsho/Tsweu.
Kopana le: Copper Alloy C2680.
Shell: Alloy ea koporo C2680/SPCC.
Qetella:
Iteanye le:Plated Khauta sebakeng sa ho tlolelana ha liphoofolo;Tin Ka Mehatla e Solder.
Shell:Nickel Plating.
Motlakase:
Tekanyetso ea Hona joale: 1.5A/Contact Terminal.
Tekanyo ea matla: 30V DC
Khokahano ea ho Kopana: 30mΩ Max.
Dielectric Withstanding Voltage:500 V AC AT Sea Level.
Khanyetsano ea Insulation: 1000MΩ Min.
Connector Mate le Unmated Force
Matla a Mate: 3.75kgf Max.
Matla a sa Kopanetsoeng: 1.02kgf Min.
Tšireletso ea Terminal: 1.2kgf Min.
