Sehokelo sa Madi Dip 90 USB KLS1-1820
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| Lintho tse bonahalang Bolulo: Thermoplastic ea Hing Temperature, UL94V-0 PBT,Ntsho/Tsweu. Kopana le: Copper Alloy C2680. Shell: Alloy ea koporo C2680/SPCC. Qetella: Iteanye le:Plated Khauta sebakeng sa ho tlolelana ha liphoofolo; Tin Ka Mehatla e Solder. Shell:Nickel Plating. Motlakase: Tekanyetso ea Hona joale: 1.5A/Contact Terminal. Tekanyo ea matla: 30V DC Khokahano ea ho Kopana: 30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Khanyetsano ea Insulation: 1000MΩ Min. Connector Mate le Unmated Force Matla a Mate: 3.75kgf Max. Matla a sa Kopanetsoeng: 1.02kgf Min. Tšireletso ea Terminal: 1.2kgf Min. |
| Karolo No. | Tlhaloso | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nako | Taelo |
