CONN MICRO USB 2P DIP KLS1-4251
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| Lintho tse bonahalang Bolulo: Thermoplastics ea mocheso oa Hing, e Ntšo. Kopana le: Copper Alloy C1591. Shell: Alloy ea koporo C2680/SPCC. Qetella: Ikopanye le: Khauta e Kentsoeng sebakeng sa Mating; Tin On Solder Talls. Shell:Nickel Plating. Motlakase: Tekanyetso ea Hona joale: 1.5A/Contact Terminal. Tekanyo ea matla: 30V DC Khokahano ea ho Kopana: 30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Khanyetsano ea Insulation: 1000MΩ Min. Connector Mate le Unmated Force Matla a Mate: 3.57kgf Max. Matla a sa Kopanetsoeng: 1.02kgf Min. |
| Karolo No. | Tlhaloso | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nako | Taelo |
