CONN MICRO USB 2P R/A DIP KLS1-4250
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Bolulo: Thermoplastics ea mocheso oa Hing, e Ntšo.
Kopana le: Copper Alloy C1591.
Shell: Alloy ea koporo C2680/SPCC.
Qetella:
Ikopanye le: Khauta e Kentsoeng sebakeng sa Mating; Tin On Solder Talls.
Shell:Nickel Plating.
Motlakase:
Tekanyetso ea Hona joale: 1.5A/Contact Terminal.
Tekanyo ea matla: 30V DC
Khokahano ea ho Kopana: 30mΩ Max.
Dielectric Withstanding Voltage: 500 V AC AT Sea Level.
Khanyetsano ea Insulation: 1000MΩ Min.
Connector Mate le Unmated Force
Matla a Mate: 3.57kgf Max.
Matla a sa Kopanetsoeng: 1.02kgf Min.
