CONN MICRO USB 5P Clip mofuta 1.0mm KLS1-4253
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Boitsebiso:
Insulation Material Thermoplastic.
Shell: Alloy ea koporo / SPCC, T = 0.30mm.
Plating: Nickel.
Theminale: Alloy ea Koporo, T=0.25mm.
Ho roala: Khauta/Tin e entsoeng.
Motlakase:
Khanyetsano ea Insulation: 1000MΩ Min.
Khokahano ea ho Kopana: 30mΩ Max.
Matla a Matla: 500 V AC.
Litšobotsi tsa Mechini:
Matla a ho Kena:3.5kgf Max.
Matla a ho Ntša:1.02kgf Min.
