Sehokelo sa Micro SIM Card,6P＋1P,PUSH PUSH,H1.85mm,Reverse MID Mount KLS1-SIM-097
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Sehokelo sa Micro SIM Card,6P＋1P,PUSH PUSH,H1.85mm, Reverse MID Mount
Boitsebiso:
Insulator:Mocheso o Phahameng oa Thermoplastic, UL94V-0,Mnyama.
Kopana le: Copper Alloy.Plated 30u” Ni Kakaretso,Sebaka sa Solder:Tin,Iteanye le G/F
Shell:Stainless,30u” Ni Kakaretso e Plated G/F Kgetho ya Sebaka sa Kopano.
Motlakase:
Boemo ba Hona joale: 0.5A max.
Tekanyetso ea matla: 50V DC max.
Boemo ba Mongobo oa Ambient:95% RH Max.
Khahlano ea ho Kopana: 100mΩ Max.
Khahlano ea Insulation: 1000MΩ Min./250V DC
Dielectric tse mamellang Voltage: 500V AC
Mating Cycles: 5000 Insertions
Mocheso oa ho sebetsa: -45ºC ~ +85ºC
