Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm KLS1-SIM-069

Lintlha tsa Sehlahisoa

Litšoantšo tsa Sehlahisoa

Tlhahisoleseding ya Sehlahiswa

Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm, Ntle le poso.

Boitsebiso:

Insulator: Mocheso o Phahameng oa Thermoplastic, UL94V-0

Kopana le: Copper Alloy,Plated 50U” Ke Kakaretso Ikopanye le Au 1U

Shell: SUS, Plated 50U” Ke Kakaretso e Plated 1u” Sebaka sa Kopano se Khethang

Motlakase:

Boemo ba Hona joale: 0.5A Max.

Tekanyetso ea matla: 5V AC/DC

Kopana le Khanyetso: 100m Max.

Khahlano ea Insulation: 1000M Min./500VDC

Boemo ba Mongobo oa Ambient:95% RH Max.

Mating Cycles:10000 Insertions

Mating Cycles: 5000 Insertions
Mocheso oa ho sebetsa: -45ºC ~ +85ºC

E fetileng: Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm KLS1-SIM-044-8P

E 'ngoe: Sehokelo sa Micro SIM Card;PUSH PUSH,6P+1P Kapa 8P+1P,H1.50mm KLS1-SIM-090