Sehlahisoa

Sehokelo sa Nano SIM Card,6Pin,H1.4mm,Mofuta o Hinged,ka CD Pin KLS1-SIM-101

Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Nano SIM Card,6Pin,H1.4mm, Mofuta o Hinged,ka CD Pin Material: Bolulo:Mocheso o Phahameng Thermoplastic,UL94V-0.Black. Terminal: Copper Alloy, Khauta e Peliloeng sebakeng sa ho ikopanya le mehatla ea solder,Nickel e kentsoeng ka tlase ho tsohle. Shell: Stainless Steel, Khauta e pentiloeng mehatleng ea solder, Nickel e kentsoeng ka tlase ho tsohle. Motlakase: E lekanyelitsoe hona joale: 0.5A Max Rated Voltage: 30V AC Resistance Resistance: 100mΩ Max. Insulation Resistance: 1000MΩ Min./500V DC Dielectric Withsta...

Sehokelo sa Nano SIM Card,6Pin,H1.4mm, Mofuta o Hinged,ka CD Pin KLS1-SIM-077A

Lits'oants'o tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Nano SIM Card,6Pin,H1.4mm, Mofuta o Hinged,ka CD Pin Material: Insulator:High Temperature Thermoplastic,UL94V-0. Contact: Copper Alloy,Plated 50u” Ni Ka Kakaretso Ikopanye le Tsohle Au 1U. Shell:SUS.All Ni 30U MIN. Motlakase: Tekanyetso ea Hona joale:0.5A AC/DC MAX. Voltage Rating:125V AC/DC Ambient Humidity Range:95% RH Max. Contact Resistance:80msuΩ0M100H Resistance:. Min./100V DC Mating Cycles: 5000 Insertation Mocheso o sebetsang: -45ºC~+85...

Sehokelo sa Nano SIM Card,6Pin,H1.4mm,Mofuta o Hinged,ntle le CD Pin KLS1-SIM-077

Litšoantšo tsa Sehlahisoa Sehokelo sa Nano SIM Card,6Pin,H1.4mm, Mofuta o Hinged, ntle le CD Pin Material: Insulator:Mocheso o Phahameng oa Thermoplastic,UL94V-0. Contact:C5210,Plated 50u” Ka Kakaretso Ikopanye le Tsohle Au 1U. Shell:SUS.All Ni 30U/MIN. Motlakase: Tekanyetso ea Hona joale: 0.5A Voltage Rating:5V AC/DC Ambient Humidity Range:95% RH Max. Contact Resistance:80mΩMax 0 MinV0/M Max. Lipotoloho: 10000 Mocheso oa Mocheso: -45ºC~+85ºC Sehokelo sa Nano SIM Card,6Pin,H1....

Sehokelo sa Nano SIM Card,PUSH PULL,6Pin,H1.4mm,ka CD Pin KLS1-SIM-092

Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Nano SIM Card Connector,PUSH PULL,6Pin,H1.4mm,ka CD Pin Material: Housing:Hi-Temperature Thermoplastic,UL94V-0.Black. Terminal:Copper Alloy,selective 1u" Au sebakeng seo ho ka kopanang le sona. Shell:Stainless Steel.selective Gold Flash sebakeng sa solder.Motlakase: Rated current:0.5A Max Rated Voltage:30V AC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ0 Motlakase oa DC50 Motlakase oa DC50 Motlakase: AC/metsotso e tšoarellang: 5000 Cycles.

Sehokelo sa Nano SIM Card;PUSH PULL,6Pin,H1.35mm KLS1-SIM-076

Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Tlhahiso ea Nano SIM Card Sehokelo;PUSH PULL,6Pin,H1.35mm Material: Insulator:Mocheso o Phahameng Thermoplastic,UL94V-0. Ikopanye le:C5210.Plated 50u” Ka Kakaretso,Ikopanye le Bohle Au 1u. Shell:SUS,Plated 50u” Ni Kakaretso,PAD Au 1u. Motlakase: Boemo ba Hona Joale: 0.5A AC/DC max. Tekanyetso ea Voltage: 125V AC/DC Khahlano ea Kopana: 100mΩ Max. Insulation Resistance:1000MΩ Min.500V DC Mocheso oa ho sebetsa: -45ºC~+85ºC

Sehokelo sa Nano SIM Card;PUSH PULL,6Pin,H1.2mm KLS1-SIM-D01

Litšoantšo tsa Sehlahisoa Boitsebiso Bohlokoa: Bolulo: High Temp.Thermoplastic, UL94V-0.Black Contact: Copper Alloy 0.10T,Gold Flash On Contact Area le Solder Area 50U” Min Nickel Under-Plated Shell:Stainless Steel 0.10T,Nickel Plating Over All Electrical:1A 000 Restance ea Motlakase 1A:00 Resistance ea Hona joale Resistance:500MΩ Min Dielectric Withstanding Voltage:500V RMS Min Life Test:1500 Cycles

Sehokelo sa Micro SIM Card,6Pin H1.42mm KLS1-SIM-105

Lintlha tsa Sehlahisoa Sehokelo sa Micro SIM Card,6Pin H1.42mm Material: Insulator:High Temperature Thermoplastic,UL 94V-0 Contact: Copper Alloy,Plated 50u” Ni Ooverall Contact Au 1U Shell:SUS,Plated 50u” Ni Ooverall,Plated 1u ea Motlakase tekanyo: 0.5mA AC/DC max tekanyo ea Voltage: 125V AC/DC Ambient Mocheso Range:-20°C~+60°C Storage Mocheso Range:-40°C~+70°C Ambient Humidity Range:95% RH max Contact resi...

Micro SIM Card CONN,6P,H1.45mm,SMD KLS1-SIM-046

Litšoantšo tsa Sehlahisoa Boitsebiso Bohlokoa: Bolulo: LCP,UL94V-0 Ikopanye:C5210 , Khauta ea Flash Plated Holong ea Kopano; Khauta Flash Plating Ka Mehatla Solder; With Entrre Contact Underplated Nickel Shell:SUS304,Nickel Underplated Holim'a Tsohle, Gold Flash Plated On Solder Tails Motlakase Litlhaloso: Hajoale Rating:0.5A Voltage Rating:5V Contact Resistance:50mΩ Max. Insulation resistance:1000MΩ Min Durabiliy:3000 Cycles Min

Sehokelo sa Micro SIM Card,8Pin H1.5mm, Mofuta o Hinged KLS1-SIM-089

Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card,8Pin H1.5mm, Mofuta o Hinged Material Housing:Thermoplastic,UL94V-0. Theminale:Phosphor Bronze,T=0.15,Ni Plated Under,Au E Alalitsoe Sebakeng sa Khokahano,G/F E Alamiloe Ka Soldertail. Shell:Stainless Steel,T=0.15,Ni Plated Under,G/F E Patiloeng Ka Soldertail. Khahlano ea Khokahano ea Motlakase: 60mΩ Max. Khanyetsano ea Insulation: 1000MΩ Min. Dielectric Withstanding Voltage: 500V AC Bakeng sa 1 Motsotso. Durability:5000 Cycles. Mocheso oa ho sebetsa: -45ºC ~ +85ºC

Sehokelo sa Micro SIM Card,6Pin H1.8mm,Mofuta o Hinged KLS1-SIM-072

Lits'oants'o tsa Sehlahisoa Sehokelo sa Micro SIM Card,6Pin H1.8mm,Mofuta oa Hinged Material: Bolulo:LCP,UL94V-0,Black. Terminal: Alloy ea koporo. Shell: Tšepe e se nang Mokelikeli. Motlakase: Boemo ba Hona Joale: 1A Max. Tekanyetso ea matla: 30V DC max. Khokahano ea ho Kopana: 30mΩ Max. Khanyetsano ea Insulation: 1000MΩ Min. Matla a Dielectric: 500V rms / min. Durability:5000 Cycles. Mocheso oa ho sebetsa: -45ºC ~ +85ºC

Sehokelo sa Micro SIM Card,6Pin H1.5mm,Tray mofuta KLS1-SIM-075

Lits'oants'o tsa Sehlahisoa Sehokelo sa Micro SIM Card,6Pin H1.5mm,Tray mofuta Material: Insulator:Hi–Temperature Plastic,UL94V-0,Black. Theminale:Copper Alloy.Gold Flash Plating on all terminal,Aad 50u” min Nickel E kentsoe ka holim'a allover. Motlakase: Tekanyetso ea Hona Joale: 0.5A Voltage Rating Voltage:5.0 vrms Insulation Resistance:1000MΩ Min./500V DC Withstanding Voltage:250V ACrms For 1Minute Contact Res...

Sehokelo sa Micro SIM Card,6P,PUSH PULL,H1.5mm KLS1-SIM-099

Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Micro SIM Card,6P,PUSH PULL,H1.5mm Material Housing:Thermoplastic,UL94V-0. Terminal: Copper Alloy, Khauta e Apehiloeng sebakeng sa Kopano le Mehatla ea Solder,Nickel e Nang le Kakaretso. Shell:Stainless Steel.Nickel e Plated Ka Kakaretso.GoldPlated On Solder Tails. Motlakase: Boemo ba Hona Joale: 1.0 A max. Khokahano ea ho Kopana: 30mΩ Max. Dielectric Withstanding Voltage: 500V AC Insulation Resistance:1000MΩ Min./500V DC Mocheso oa ho sebetsa: -45ºC~+85ºC

Sehokelo sa Micro SIM Card,8P,PUSH PULL,H1.5mm KLS1-SIM-091

Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card,8P,PUSH PULL,H1.5mm Motlakase: E Lekanyelitsoe Hona Joale:1.0A Lebelo la Matla:30V Ho hanyetsana le Kopana:50mΩ Max. Insulation Resistance:1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC Solder abiltiy:250oC~%%P5oC,10%%P0.5s Durability:5000 Cycles Min. Khahlano ea ho Kopana: 50mΩ Max. Mocheso oa ho sebetsa: -45ºC ~ +85ºC

Sehokelo sa Micro SIM Card, 6P

Litšoantšo tsa Sehlahisoa

Sehokelo sa Micro SIM Card, 6P

Litšoantšo tsa Sehlahisoa

Sehokelo sa Micro SIM Card,8P

Litšoantšo tsa Sehlahisoa

Sehokelo sa Micro SIM Card,8P

Litšoantšo tsa Sehlahisoa

Sehokelo sa Micro SIM Card,8P

Litšoantšo tsa Sehlahisoa

Sehokelo sa Micro SIM Card, 6P

Litšoantšo tsa Sehlahisoa

Sehokelo sa Micro SIM Card;PUSH PUSH,6P+1P Kapa 8P+1P,H1.50mm KLS1-SIM-090

Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Micro SIM Card;PUSH PUSH,6P +1P Kapa 8P + 1P,H1.50mm Tekanyetso ea Hona Joale ea Motlakase: 0.5A Voltage Rating: 5.0 vrms Ho hanyetsa ho kopana: 100mΩ Max. Insulation resistance: 1000M Min. Ho mamella Voltage: 250V ACrms Bakeng sa Motsotso o le mong. Operating TempRange:-45℃-+105℃ Material: Insulator:Hi-Temperature plastic,UL94V-0,Black Terminal:Copper Alloy,Gold Flash Plating On All Terminal, Le 50u” min nickel e kentsoe ka tlas'a allover.Shell:Stainless Steel,50u&...

Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm KLS1-SIM-069

Lintlha tsa Sehlahisoa Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm,Ntle le poso. Material: Insulator:High Temperature Thermoplastic,UL94V-0 Contact: Copper Alloy,Plated 50U” Ni Overall Contact Au 1U Shell:SUS,Plated 50U” Ni Overall Plated 1u” Au Selective Contact Area Motlakase: Current Rating: 0.5A Max. Khanyetso:1000M Min./500VDC Ambient Humidity Range:95% RH Max Mati.

Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm KLS1-SIM-044-8P

Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm Material: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Khokahano ea Boitsebiso: Copper Alloy, Gold Plated. Shell:Stainless Steel,Gold Plated. Motlakase: Khahlano ea ho Kopana: 50mΩ e tloaelehileng, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Mohato oa Mouoane:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ho soasoa ka letsoho: 370ºC.3sec.Max. Mocheso oa ho sebetsa: -45ºC ~+105ºC

Sehokelo sa Micro SIM Card 6P,PUSH PULL,H2.4mm KLS1-SIM-044-6P

Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Micro SIM Card 6P,PUSH PULL,H2.4mm Material: Base: Hi-Temp Thermoplastic,UL94V-0.Black. Khokahano ea Boitsebiso: Copper Alloy, Gold Plated. Shell:Stainless Steel,Gold Plated. Motlakase: Khahlano ea ho Kopana: 50mΩ e tloaelehileng, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Mohato oa Mouoane:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ho soasoa ka letsoho: 370ºC.3sec.Max. Mocheso oa ho sebetsa: -45ºC ~+105ºC

Sehokelo sa SIM Card;PUSH PUSH,6P+2P,H1.80mm,Ka poso kapa Ntle le poso. KLS1-SIM-110

Litšoantšo tsa Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card;PUSH PUSH,6P+2P,H1.80mm Ka poso kapa Ntle le poso. Boitsebiso: Boitsebiso ba Bolulo: LCP UL94V-0 Boitsebiso ba ho Kopana: Sephutheloana sa Tin-Bronze: Theipi le Reel Package Litšobotsi tsa Motlakase: Tekanyo ea Voltage: 100V AC Tekanyetso ea Hona joale: 0.5A Max Mamella matla: 250V AC/1Minute Insulation resistance0: ≩1Minute Insulation resistance0: ≩1 Ho hanyetsa ≩0 ≩1 Bophelo: ~5000 Cycles Mocheso oa ho sebetsa: -45ºC ~+85ºC