Sehokelo sa Nano SIM Card,6Pin,H1.4mm,Mofuta o Hinged,ka CD Pin KLS1-SIM-101
Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Nano SIM Card,6Pin,H1.4mm, Mofuta o Hinged,ka CD Pin Material: Bolulo:Mocheso o Phahameng Thermoplastic,UL94V-0.Black. Terminal: Copper Alloy, Khauta e Peliloeng sebakeng sa ho ikopanya le mehatla ea solder,Nickel e kentsoeng ka tlase ho tsohle. Shell: Stainless Steel, Khauta e pentiloeng mehatleng ea solder, Nickel e kentsoeng ka tlase ho tsohle. Motlakase: E lekanyelitsoe hona joale: 0.5A Max Rated Voltage: 30V AC Resistance Resistance: 100mΩ Max. Insulation Resistance: 1000MΩ Min./500V DC Dielectric Withsta...
Sehokelo sa Nano SIM Card,6Pin,H1.4mm, Mofuta o Hinged,ka CD Pin KLS1-SIM-077A
Lits'oants'o tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Nano SIM Card,6Pin,H1.4mm, Mofuta o Hinged,ka CD Pin Material: Insulator:High Temperature Thermoplastic,UL94V-0. Contact: Copper Alloy,Plated 50u” Ni Ka Kakaretso Ikopanye le Tsohle Au 1U. Shell:SUS.All Ni 30U MIN. Motlakase: Tekanyetso ea Hona joale:0.5A AC/DC MAX. Voltage Rating:125V AC/DC Ambient Humidity Range:95% RH Max. Contact Resistance:80msuΩ0M100H Resistance:. Min./100V DC Mating Cycles: 5000 Insertation Mocheso o sebetsang: -45ºC~+85...
Sehokelo sa Nano SIM Card,6Pin,H1.4mm,Mofuta o Hinged,ntle le CD Pin KLS1-SIM-077
Litšoantšo tsa Sehlahisoa Sehokelo sa Nano SIM Card,6Pin,H1.4mm, Mofuta o Hinged, ntle le CD Pin Material: Insulator:Mocheso o Phahameng oa Thermoplastic,UL94V-0. Contact:C5210,Plated 50u” Ka Kakaretso Ikopanye le Tsohle Au 1U. Shell:SUS.All Ni 30U/MIN. Motlakase: Tekanyetso ea Hona joale: 0.5A Voltage Rating:5V AC/DC Ambient Humidity Range:95% RH Max. Contact Resistance:80mΩMax 0 MinV0/M Max. Lipotoloho: 10000 Mocheso oa Mocheso: -45ºC~+85ºC Sehokelo sa Nano SIM Card,6Pin,H1....
Sehokelo sa Nano SIM Card,PUSH PULL,6Pin,H1.4mm,ka CD Pin KLS1-SIM-092
Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Nano SIM Card Connector,PUSH PULL,6Pin,H1.4mm,ka CD Pin Material: Housing:Hi-Temperature Thermoplastic,UL94V-0.Black. Terminal:Copper Alloy,selective 1u" Au sebakeng seo ho ka kopanang le sona. Shell:Stainless Steel.selective Gold Flash sebakeng sa solder.Motlakase: Rated current:0.5A Max Rated Voltage:30V AC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ0 Motlakase oa DC50 Motlakase oa DC50 Motlakase: AC/metsotso e tšoarellang: 5000 Cycles.
Sehokelo sa Nano SIM Card;PUSH PULL,6Pin,H1.35mm KLS1-SIM-076
Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Tlhahiso ea Nano SIM Card Sehokelo;PUSH PULL,6Pin,H1.35mm Material: Insulator:Mocheso o Phahameng Thermoplastic,UL94V-0. Ikopanye le:C5210.Plated 50u” Ka Kakaretso,Ikopanye le Bohle Au 1u. Shell:SUS,Plated 50u” Ni Kakaretso,PAD Au 1u. Motlakase: Boemo ba Hona Joale: 0.5A AC/DC max. Tekanyetso ea Voltage: 125V AC/DC Khahlano ea Kopana: 100mΩ Max. Insulation Resistance:1000MΩ Min.500V DC Mocheso oa ho sebetsa: -45ºC~+85ºC
Sehokelo sa Nano SIM Card;PUSH PULL,6Pin,H1.2mm KLS1-SIM-D01
Litšoantšo tsa Sehlahisoa Boitsebiso Bohlokoa: Bolulo: High Temp.Thermoplastic, UL94V-0.Black Contact: Copper Alloy 0.10T,Gold Flash On Contact Area le Solder Area 50U” Min Nickel Under-Plated Shell:Stainless Steel 0.10T,Nickel Plating Over All Electrical:1A 000 Restance ea Motlakase 1A:00 Resistance ea Hona joale Resistance:500MΩ Min Dielectric Withstanding Voltage:500V RMS Min Life Test:1500 Cycles
Sehokelo sa Micro SIM Card,8Pin H1.5mm, Mofuta o Hinged KLS1-SIM-089
Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card,8Pin H1.5mm, Mofuta o Hinged Material Housing:Thermoplastic,UL94V-0. Theminale:Phosphor Bronze,T=0.15,Ni Plated Under,Au E Alalitsoe Sebakeng sa Khokahano,G/F E Alamiloe Ka Soldertail. Shell:Stainless Steel,T=0.15,Ni Plated Under,G/F E Patiloeng Ka Soldertail. Khahlano ea Khokahano ea Motlakase: 60mΩ Max. Khanyetsano ea Insulation: 1000MΩ Min. Dielectric Withstanding Voltage: 500V AC Bakeng sa 1 Motsotso. Durability:5000 Cycles. Mocheso oa ho sebetsa: -45ºC ~ +85ºC
Sehokelo sa Micro SIM Card,6Pin H1.8mm,Mofuta o Hinged KLS1-SIM-072
Lits'oants'o tsa Sehlahisoa Sehokelo sa Micro SIM Card,6Pin H1.8mm,Mofuta oa Hinged Material: Bolulo:LCP,UL94V-0,Black. Terminal: Alloy ea koporo. Shell: Tšepe e se nang Mokelikeli. Motlakase: Boemo ba Hona Joale: 1A Max. Tekanyetso ea matla: 30V DC max. Khokahano ea ho Kopana: 30mΩ Max. Khanyetsano ea Insulation: 1000MΩ Min. Matla a Dielectric: 500V rms / min. Durability:5000 Cycles. Mocheso oa ho sebetsa: -45ºC ~ +85ºC
Sehokelo sa Micro SIM Card,6Pin H1.5mm,Tray mofuta KLS1-SIM-075
Lits'oants'o tsa Sehlahisoa Sehokelo sa Micro SIM Card,6Pin H1.5mm,Tray mofuta Material: Insulator:Hi–Temperature Plastic,UL94V-0,Black. Theminale:Copper Alloy.Gold Flash Plating on all terminal,Aad 50u” min Nickel E kentsoe ka holim'a allover. Motlakase: Tekanyetso ea Hona Joale: 0.5A Voltage Rating Voltage:5.0 vrms Insulation Resistance:1000MΩ Min./500V DC Withstanding Voltage:250V ACrms For 1Minute Contact Res...
Sehokelo sa Micro SIM Card,6P,PUSH PULL,H1.5mm KLS1-SIM-099
Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Micro SIM Card,6P,PUSH PULL,H1.5mm Material Housing:Thermoplastic,UL94V-0. Terminal: Copper Alloy, Khauta e Apehiloeng sebakeng sa Kopano le Mehatla ea Solder,Nickel e Nang le Kakaretso. Shell:Stainless Steel.Nickel e Plated Ka Kakaretso.GoldPlated On Solder Tails. Motlakase: Boemo ba Hona Joale: 1.0 A max. Khokahano ea ho Kopana: 30mΩ Max. Dielectric Withstanding Voltage: 500V AC Insulation Resistance:1000MΩ Min./500V DC Mocheso oa ho sebetsa: -45ºC~+85ºC
Sehokelo sa Micro SIM Card,8P,PUSH PULL,H1.5mm KLS1-SIM-091
Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card,8P,PUSH PULL,H1.5mm Motlakase: E Lekanyelitsoe Hona Joale:1.0A Lebelo la Matla:30V Ho hanyetsana le Kopana:50mΩ Max. Insulation Resistance:1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC Solder abiltiy:250oC~%%P5oC,10%%P0.5s Durability:5000 Cycles Min. Khahlano ea ho Kopana: 50mΩ Max. Mocheso oa ho sebetsa: -45ºC ~ +85ºC
Sehokelo sa Micro SIM Card;PUSH PUSH,6P+1P Kapa 8P+1P,H1.50mm KLS1-SIM-090
Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Micro SIM Card;PUSH PUSH,6P +1P Kapa 8P + 1P,H1.50mm Tekanyetso ea Hona Joale ea Motlakase: 0.5A Voltage Rating: 5.0 vrms Ho hanyetsa ho kopana: 100mΩ Max. Insulation resistance: 1000M Min. Ho mamella Voltage: 250V ACrms Bakeng sa Motsotso o le mong. Operating TempRange:-45℃-+105℃ Material: Insulator:Hi-Temperature plastic,UL94V-0,Black Terminal:Copper Alloy,Gold Flash Plating On All Terminal, Le 50u” min nickel e kentsoe ka tlas'a allover.Shell:Stainless Steel,50u&...
Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm KLS1-SIM-069
Lintlha tsa Sehlahisoa Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm,Ntle le poso. Material: Insulator:High Temperature Thermoplastic,UL94V-0 Contact: Copper Alloy,Plated 50U” Ni Overall Contact Au 1U Shell:SUS,Plated 50U” Ni Overall Plated 1u” Au Selective Contact Area Motlakase: Current Rating: 0.5A Max. Khanyetso:1000M Min./500VDC Ambient Humidity Range:95% RH Max Mati.
Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm KLS1-SIM-044-8P
Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm Material: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Khokahano ea Boitsebiso: Copper Alloy, Gold Plated. Shell:Stainless Steel,Gold Plated. Motlakase: Khahlano ea ho Kopana: 50mΩ e tloaelehileng, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Mohato oa Mouoane:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ho soasoa ka letsoho: 370ºC.3sec.Max. Mocheso oa ho sebetsa: -45ºC ~+105ºC
Sehokelo sa Micro SIM Card 6P,PUSH PULL,H2.4mm KLS1-SIM-044-6P
Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Micro SIM Card 6P,PUSH PULL,H2.4mm Material: Base: Hi-Temp Thermoplastic,UL94V-0.Black. Khokahano ea Boitsebiso: Copper Alloy, Gold Plated. Shell:Stainless Steel,Gold Plated. Motlakase: Khahlano ea ho Kopana: 50mΩ e tloaelehileng, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Mohato oa Mouoane:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ho soasoa ka letsoho: 370ºC.3sec.Max. Mocheso oa ho sebetsa: -45ºC ~+105ºC
Sehokelo sa SIM Card;PUSH PUSH,6P+2P,H1.80mm,Ka poso kapa Ntle le poso. KLS1-SIM-110
Litšoantšo tsa Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card;PUSH PUSH,6P+2P,H1.80mm Ka poso kapa Ntle le poso. Boitsebiso: Boitsebiso ba Bolulo: LCP UL94V-0 Boitsebiso ba ho Kopana: Sephutheloana sa Tin-Bronze: Theipi le Reel Package Litšobotsi tsa Motlakase: Tekanyo ea Voltage: 100V AC Tekanyetso ea Hona joale: 0.5A Max Mamella matla: 250V AC/1Minute Insulation resistance0: ≩1Minute Insulation resistance0: ≩1 Ho hanyetsa ≩0 ≩1 Bophelo: ~5000 Cycles Mocheso oa ho sebetsa: -45ºC ~+85ºC