Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Poso Boitsebiso: Insulator:H-Temperature Plastic,UL94V-0.Black. Khokahano: Alloy ea Koporo,T=0.15mm;Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel E kentsoeng ka tlas'a Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel e Tlatselitsoe ho Allover, Khauta ea Khauta ho Solder Latch. Motlakase: Boemo ba hajoale: 0.5A Tekanyo ea matla: 5.0 Vrms. Khahlano ea Insulation: 500M Min.At DC 500V DC Ho mamella Voltage: 250V ACrms Bakeng sa Motsotso o le mong. Kopana le Khanyetso: 100M Max.At 10MA/20mV MAX. Mocheso oa ho sebetsa: -45ºC ~+105ºC Mating Cycles: 5000 Insertions. |