Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H2.25mm,ntle le Post KLS1-SIM-030A
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Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H2.25mm, ntle le Poso
Boitsebiso:
Matlo:Hi-Temp Plastic,UL94V-0.Rated.
Kopana le: Copper Alloy.
Shell:Stainless Steel.SUS 301,T=0.20mm.
Plating:
Sebaka sa Marang-rang:G/F E entsoe ka 30u” Nickel
Sebaka sa Solder: 80u "Tin Plated over 30u" Nickel. Tlas'a poleiti: 30u "Min Nickel.
Shell:30u” Min,Nickel e Patiloeng Holim'a Tsohle, Sebaka sa Solder: Khauta ea Khauta.
Motlakase:
Boemo ba hajoale: 0.5 A
Dielectric e mamellang Voltage: 250V AC / DC.
Khanyetsano ea Insulation: 500MΩ Min.
Khahlano ea ho Kopana: 100mΩ Max.
Mating Cycles: 5000 Insertions.
Mocheso oa ho sebetsa: -45ºC ~ +85ºC