Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Post KLS1-SIM-030E
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| Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Poso Boitsebiso: Matlo:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell:Stainless Steel.SUS 301,T=0.20mm. Plating: Sebaka sa Marang-rang:G/F E entsoe ka holimo ho 30u" Nickel Sebaka se rekisoang:80u" Tin e entsoeng ka holim'a 30u" Nickel. Tlas'a poleiti: 30u" Min Nickel. Shell: 30u" Min, Nickel e Patiloe ka Tsohle, SolderSebaka: Khauta ea Khauta. Motlakase: Boemo ba hajoale: 0.5 A Dielectric e mamellang Voltage: 250V AC / DC. Khanyetsano ea Insulation: 500MΩ Min. Khahlano ea ho Kopana: 100mΩ Max. Mating Cycles: 5000 Insertions. Mocheso oa ho sebetsa: -45ºC ~ +85ºC |
| Karolo No. | Tlhaloso | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nako | Taelo |
