Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Post KLS1-SIM-087

Lintlha tsa Sehlahisoa

Litšoantšo tsa Sehlahisoa

Tlhahisoleseding ya Sehlahiswa

Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Poso

Boitsebiso:

Insulator:H-Temperature Plastic,UL94V-0.Black.

Khokahano: Alloy ea Koporo, T=0.15mm

Shell: tšepe e sa hloekang, T = 0.15mm

Finsh:

Terminal: 50u" min Nickel e kentsoe ka tlas'a Allover, Ho roala Khauta ho Contact Arer,80u" min

Tin ho Solder Tail.

Shell:50u” Nickel e kentsoe ka tlas'a Allover, Gold Flash ho Solder Latch.

Motlakase:

Boemo ba hajoale: 0.5A

Tekanyo ea matla: 5.0 Vrms.

Khahlano ea Insulation: 500M Min.At DC 500V DC

Ho mamella Voltage: 250V ACrms Bakeng sa Motsotso o le mong.

Kopana le Khanyetso: 100M Max.At 10MA/20mV MAX.

Mating Cycles: 5000 Insertions.
Mocheso oa ho sebetsa: -45ºC ~ +85ºC

E fetileng: Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Post KLS1-SIM-086

E 'ngoe: Sehokelo sa SIM Card;PUSH PUSH,6P,H1.85mm KLS1-SIM-106