Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Post KLS1-SIM-087
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| Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Poso Boitsebiso: Insulator:H-Temperature Plastic,UL94V-0.Black. Khokahano: Alloy ea Koporo, T=0.15mm Shell: tšepe e sa hloekang, T = 0.15mm Finsh: Terminal:50u" min Nickel e kentsoe ka tlas'a Allover,Gold Plating ho Contact Arer,80u" min Tin ho Solder Tail. Shell:50u" Nickel e Tlatselitsoe ho Allover, Khauta ea Khauta ho Solder Latch. Motlakase: Boemo ba hajoale: 0.5A Tekanyo ea matla: 5.0 Vrms. Khahlano ea Insulation: 500M Min.At DC 500V DC Ho mamella Voltage: 250V ACrms Bakeng sa Motsotso o le mong. Kopana le Khanyetso: 100M Max.At 10MA/20mVMAX. Mating Cycles: 5000 Insertions. Mocheso oa ho sebetsa: -45ºC ~ +85ºC |
| Karolo No. | Tlhaloso | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nako | Taelo |
