Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm, ntle le Post KLS1-SIM-074A
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Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm, ntle le Poso
Boitsebiso:
Insulator: H-MochesoPlastiki,UL94V-0.Mnyama.
Khokahano: Alloy ea Koporo, T=0.15mm
Shell: tšepe e sa hloekang, T = 0.15mm
Finsh:
Terminal: 50u" min Nickel e kentsoe ka tlas'a lefatšeAllover, Gold Plating ho Contact Arer,80u” minTin ho Solder Tail.
Shell:50u” Nickel e Kentsoe ka Tlase ho Allover, KhautaFlash ho Solder Latch.
Motlakase:
Boemo ba hajoale: 0.5A
Tekanyo ea matla: 5.0 Vrms.
Khahlano ea Insulation: 500M Min.At DC 500V DC
Ho mamella Voltage: 250V ACrms Bakeng sa Motsotso o le mong.
Kopana le Khanyetso: 100M Max.At 10MA/20mV MAX.
Mocheso oa ho sebetsa: -45ºC ~ +85ºC
Mating Cycles: 5000 Insertions.