Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm,ntle le Post KLS1-SIM-074B
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Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm, ntle le Poso
Boitsebiso:
Bolulo:Mocheso o Phahameng
Thermoplastic,UL94V-0.Mnyama.
Kopana le: Copper Alloy.
Sekoahelo: Ikopanye: Li-alloys tsa Koporo Kapa Tšepe.
Plating:
Letlapa: Nickel.
Sebaka sa Kopano: Gold Over Nickel.
Sebaka sa Solder: Tin Over Nickel.
Shell:G/F Plate Over Nickel On Solder Tails
Motlakase:
Boemo ba hajoale: 0.5A
Tekanyo ea matla: 5.0 Vrms.
Khahlano ea Insulation: 500M Min.At DC 500V DC
Ho mamella Voltage: 250V ACrms Bakeng sa Motsotso o le mong.
Kopana le Khanyetso: 100M Max.At 10MA/20mV MAX.
Mocheso oa ho sebetsa: -45ºC ~ +85ºC
Mating Cycles: 5000 Insertions.