Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm,ntle le Post KLS1-SIM-074B
Ka kopo, khoasolla lintlha tsa PDF:
Lintlha tsa Sehlahisoa
Li-tag tsa Sehlahisoa
 |  | ||
|
| Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm, ntle le Poso Boitsebiso: Bolulo:Mocheso o Phahameng Thermoplastic,UL94V-0.Mnyama. Kopana le: Copper Alloy. Sekoahelo: Ikopanye: Li-alloys tsa Koporo Kapa Tšepe. Plating: Letlapa: Nickel. Sebaka sa Kopano: Gold Over Nickel. Sebaka sa Solder: Tin Over Nickel. Shell:G/F Plate Over Nickel On Solder Tails Motlakase: Boemo ba hajoale: 0.5A Tekanyo ea matla: 5.0 Vrms. Khahlano ea Insulation: 500M Min.At DC 500V DC Ho mamella Voltage: 250V ACrms Bakeng sa Motsotso o le mong. Kopana le Khanyetso: 100M Max.At 10MA/20mVMAX. Mocheso oa ho sebetsa: -45ºC ~ +85ºC Mating Cycles: 5000 Insertions. |
| Karolo No. | Tlhaloso | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nako | Taelo |
