Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.9mm,ka Post KLS1-SIM-108
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Sehokelo sa SIM Card, PUSH PUSH,8P+1P,H1.9mm, ka Post
Boitsebiso:
Matlo:Hi-Temp Plastic,UL94V-0.Rated.
Kopana le: Copper Alloy.
Shell: Alloy ea koporo.
Plating:
Sebaka sa Kopano: Khauta ea flash.
Sebaka sa Solder:80u” Min, Matte tin alloy e kentsoeng.
Tlas'a poleiti: 30u" min, Nickel.
Shell:30u” Min, Nickel e tletse ka kakaretso
Sebaka sa Solder: Gole flash.
Sebaka sa Solder: Gole flash.
Motlakase:
Boemo ba hajoale: 0.5A
Ho mamella Voltage: AC500V rms
Khahlano ea Insulation: 1000MΩMin, Ho DC 500V
Khahlano ea ho Kopana: 100mΩ Max.
Mating Cycles:3000 Insertions.
Mocheso oa ho sebetsa: -45ºC ~ +85ºC