Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.9mm,ka Post KLS1-SIM-108
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| Sehokelo sa SIM Card, PUSH PUSH,8P+1P,H1.9mm, ka Post Boitsebiso: Matlo:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: Alloy ea koporo. Plating: Sebaka sa Kopano: Khauta ea flash. Sebaka sa Solder: 80u" Min, Matte tin alloy e kentsoeng. Tlas'a poleiti: 30u" min, Nickel. Shell:30u" Min, Nickel e tletse ka kakaretso Sebaka sa Solder: Gole flash. Motlakase: Boemo ba hajoale: 0.5A Ho mamella Voltage: AC500V rms Khahlano ea Insulation: 1000MΩMin, Ho DC 500V Khahlano ea ho Kopana: 100mΩ Max. Mating Cycles:3000 Insertions. Mocheso oa ho sebetsa: -45ºC ~ +85ºC |
| Karolo No. | Tlhaloso | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nako | Taelo |
