CONN MICRO USB 5P Clip mofuta 1.0mm KLS1-4253
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| Boitsebiso: Insulation Material Thermoplastic. Shell: Alloy ea koporo / SPCC, T = 0.30mm. Plating: Nickel. Theminale: Alloy ea Koporo, T=0.25mm. Ho roala: Khauta/Tin e entsoeng. Motlakase: Khanyetsano ea Insulation: 1000MΩ Min. Khokahano ea ho Kopana: 30mΩ Max. Matla a Matla: 500 V AC. Litšobotsi tsa Mechini: Matla a ho Kena:3.5kgf Max. Matla a ho Ntša:1.02kgf Min. |
| Karolo No. | Tlhaloso | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nako | Taelo |
