Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm KLS1-SIM-069
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| Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm, Ntle le poso. Boitsebiso: Insulator:Mocheso o phahamengThermoplastic, UL94V-0 Kopana le: Copper Alloy,Plated 50U" NiKakaretso Ikopanye le Au 1U Shell: SUS, Plated 50U" Ni Overall Plated 1u"Sebaka sa Kopano sa Au Selective Motlakase: Boemo ba Hona joale: 0.5A Max. Tekanyetso ea matla: 5V AC/DC Kopana le Khanyetso: 100m Max. Khahlano ea Insulation: 1000M Min./500VDC Boemo ba Mongobo oa Ambient:95% RH Max. Mating Cycles:10000 Insertions Mating Cycles: 5000 Insertions Mocheso oa ho sebetsa: -45ºC ~ +85ºC |
| Karolo No. | Tlhaloso | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nako | Taelo |
