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Lihokelo tsa Micro USB

MICRO USB 3.0 Mosadi,10P SMD KLS1-234-10F3

Boitsebiso ba Sehlahisoa Boitsebiso: Bolulo: LCP,UL94V-0 Ikopanye: Copper Alloy. Ho roala Khauta AT Contact Area Tin Plating ka Mehatla. Shell:SUS304.Tin Plated Electrical: Ikopanye le Boemo ba Hona Joale: 1.0A Max. Kopana le Khanyetso: 30m? Max. Insulation Resistance: 100M? Min. Dielectric Withstanding Voltage: 100V AC RMS Mocheso wa Tshebetso: -30°C ~ +80°C. Litšobotsi tsa Mechini: Matla a Ho Kopana: 3.5kgf Max. Matla a sa Kopaneng: 1.0kgf Min. Dura...

MICRO USB 3.0 Mosadi,10P E Emeng SMD KLS1-234-10F2

Boitsebiso ba Sehlahisoa Boitsebiso: Bolulo: LCP,UL94V-0 Ikopanye: Copper Alloy. Ho roala Khauta AT Contact Area Tin Plating ka Mehatla. Shell:SUS304.Tin Plated Electrical: Kopana le Tekanyetso ea Hona Joale: 1.5A Max. Kopana le Khanyetso: 30m? Max. Insulation Resistance: 100M? Min. Dielectric Withstanding Voltage: 100V AC RMS Mocheso wa Tshebetso: -20°C ~ +60°C. Litšobotsi tsa Mechini: Matla a Ho Kopana: 3.5kgf Max. Matla a sa Kopaneng: 1.0kgf Min. Dura...

MICRO USB 3.0 Mosadi,10P SMD KLS1-234-10F1

Boitsebiso ba Sehlahisoa Boitsebiso: Bolulo: LCP,UL94V-0 Ikopanye: Copper Alloy. Ho roala Khauta AT Contact Area Tin Plating ka Mehatla. Shell:SUS304.Tin Plated Electrical: Ikopanye le Boemo ba Hona Joale: 1.0A Max. Kopana le Khanyetso: 30m? Max. Insulation Resistance: 100M? Min. Dielectric Withstanding Voltage: 100V AC RMS Mocheso wa Tshebetso: -30°C ~ +80°C. Litšobotsi tsa Mechini: Matla a Ho Kopana: 3.5kgf Max. Matla a sa Kopaneng: 1.0kgf Min. Dura...

MICRO USB 3.0 PLUG,10P Solder KLS1-234-10M1

Boitsebiso ba Sehlahisoa Boitsebiso: Bolulo: Thermoplastic,UL94V-0 Contact: Copper Alloy. Setšoantšo: SUS201. Plating: Kopana le:Gold Plating Bona Tafole AT Contact Area Tin Plating AT Solder Area. Nickel ka Tlas'a Paletla ka Hohle. Shell: Nickel ea Solder e Kentsoe Ka Hohle. Motlakase: Mocheso oa ho sebetsa: -20°C HO +80°C. Karolo ea No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. Taelo ya Nako

CONN PLUG MICRO USB MOFUTA B CLIP KLS1-236-5M8

Thepa ea Thermoplastic ea Hing, UL94V-0 LCP,Black. Ikopanye le:C2680/C5191. Shell: Tšepe. Qetella: Iteanye le:Plated Khauta Sebakeng Mating; Tin Lead Holim'a Talls. Shell: Tin lead Plating. Motlakase: Thibelo ea ho Kopana: 30mΩ Max. Dielectric Withstanding Voltage: 50 V AC AT Sea Level. Khanyetsano ea Insulation: 100MΩ Min. Karolo ea No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. Nako ea Nako...

CONN PLUG MICRO USB TYPE B CLIP L8.8 KLS1-236-5M7

Bolulo ba Boitsebiso ba Sehlahisoa: Thermoplastic ea Hing Thermoplastic e nang le gf,UL94V-0. Khokahano: Alloy ea Koporo,t=0.20mm. Shell:SUS,t=0.20mm. Motlakase: Boemo ba Hona Joale: 1A Max. Dielectric Withstanding Voltage: 100 V AC bakeng sa 1 min. Khahlano ea ho Kopana: 50mΩ Max. Khanyetsano ea Insulation: 100MΩ Min. Kakaretso ea Matla a Mating:3.57 kgf Max. Kakaretso ea Matla a sa Kopaneng: 1.0 kgf Min. Thempereichara Range: -30°C Ho ea Ho +80°C Karolo No. Tlhaloso PCS/CTN GW..

CONN PLUG MICRO USB MOFUTA B CLIP L6.8 KLS1-236-5M6

Tlhahisoleseling ea Sehlahisoa Material Housing: Thermoplastic ea Hing Thermoplastic e nang le gf,UL94V-0. Khokahano: Alloy ea Koporo,t=0.20mm. Shell:SUS,t=0.20mm. Motlakase: Boemo ba Hona Joale: 1A Max. Dielectric Withstanding Voltage: 100 V AC bakeng sa 1 min. Khahlano ea ho Kopana: 50mΩ Max. Khanyetsano ea Insulation: 100MΩ Min. Kakaretso ea Matla a Mating:3.57 kgf Max. Kakaretso ea Matla a sa Kopaneng: 1.0 kgf Min. Thempereichara Range: -30 °C Ho ea Ho +80°C Karolo No. Descripti...

CONN PLUG MICRO USB MOFUTA B SMD KLS1-236-5M3

Thepa ea Thermoplastic ea Hing, UL94V-0 LCP,Black. Ikopanye le:C2680/C5191. Shell: Koporo / tšepe / tšepe e sa hloekang. Qetella: Iteanye le:Plated Khauta Sebakeng Mating; Tin Lead Holim'a Talls. Shell: Tin lead Plating. Motlakase: Thibelo ea ho Kopana: 30mΩ Max. Dielectric Withstanding Voltage: 50 V AC AT Sea Level. Khanyetsano ea Insulation: 100MΩ Min. Karolo ea No. Tlhaloso PCS/CTN GW(KG) CMB(m3) Ord...

CONN PLUG MICRO USB MOFUTA B SMD KLS1-236-5M2

Boitsebiso ba Sehlahisoa Boitsebiso: Bolulo: Hing Temperature Plastic, UL94V-0,Black. Ikopanye le:C2680/C5191. Shell: Koporo. Qetella: Iteanye le:Plated Khauta Sebakeng Mating; Tin Lead Holim'a Talls. Shell:Nickel Plating. Motlakase: Thibelo ea ho Kopana: 30mΩ Max. Khanyetsano ea Insulation: 100MΩ Min. Karolo ea No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. Taelo ya Nako

CONN PLUG MICRO USB MOFUTA B PCB MID MOUNT KLS1-236-5M1

Bolulo ba Boitsebiso ba Tlhahisoleseling ea Sehlahisoa: LCP,UL94V-0,Mnyama. Kopana le: Copper Alloy. Shell:SUS 304 T=0.20. Qetella: Ikopanye: Ho roala Khauta sebakeng sa Khokahano. 80u "Sn Plating sebakeng sa mohatla oa solder. 50u" Min.Nickel Under plating holim'a tsohle. Motlakase: Tekanyetso ea Voltage: 30VAC RMS. Boemo ba Hona joale: 2.0A(pin 1 5); 1.0A(pin 2 3 4). Khahlano ea ho Kopana: 50mΩ Max. Khanyetsano ea Insulation: 100MΩ Min. Dielectric Withstanding Voltage: 500 V AC Bakeng sa ...

CONN PLUG MICRO USB Solder KLS1-235-5

Boitsebiso ba Sehlahisoa Boitsebiso: Bolulo: LCP E130, UL94V-0 Black Contact: Brass 5210. Shell: Stainless Steel, T=0.20±0.03mm. Plating: Ikopanye:Plated Khauta Flash Bakeng sa Contact Area. Shell:Nickel Over All (sefako sa letsoai bakeng sa 24H). Shell:Gold Over All (sefako sa letsoai bakeng sa 24H). Motlakase: Mocheso oa ho sebetsa: -20°C HO +80°C. Sehlahisoa se Ikamahanya le kopo ea RoHS Karolo ea No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. Taelo ya Nako

CONN PLUG MICRO USB TYPE B Solder KLS1-235-3

Tlhahisoleseling ea Sehlahisoa: Bolulo: LCP ,UL94V-0 Black. Khokahano: Phosphor Bronze,T=0.20±0.01mm. Khetla e ka Pele: Tšepe e se nang tšepe, T=0.20±0.01mm. Shell e ka morao: tšepe e se nang tšepe, T=0.20±0.01mm. Clap:Tšepe e se nang tšepe,T=0.40±0.01mm. Qetello: Mabitso: Khauta e bentšitsoe, sebakeng sa Kopano. 100u-120u" Tin.Plating, holim'a mehatla ea solder. 50u-80u" Nickel, Underplating holim'a tsohle. Motlakase: Boemo ba Hona Joale: 1A Max. Dielectric Withstanding Volta...

CONN PLUG MICRO USB TYPE B Solder T3.0,L8.8mm KLS1-235-2

Thepa ea Thermoplastic ea Hing, UL94V-0 LCP,Black. Kopana le: Copper Alloy C2680. Shell: Alloy ea koporo C2680/SPCC. Qetella: Iteanye le:Plated Khauta Sebakeng Mating; Tin On Solder Talls. Shell:Nickel Plating. Motlakase: Boemo ba Hona Joale: 1.5A/Contact Terminal. Tekanyetso ea Voltage: 30V DC Contact Resistance: 30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Khanyetsano ea Insulation: 1000MΩ Min. Conn...

CONN PLUG MICRO USB TYPE B Solder T3.0,L6.8mm KLS1-235-1

Thepa ea Thermoplastic ea Hing, UL94V-0 LCP,Black. Kopana le: Copper Alloy C2680. Shell: Alloy ea koporo C2680/SPCC. Qetella: Iteanye le:Plated Khauta Sebakeng Mating; Tin On Solder Talls. Shell:Nickel Plating. Motlakase: Boemo ba Hona Joale: 1.5A/Contact Terminal. Tekanyetso ea Voltage: 30V DC Contact Resistance: 30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Khanyetsano ea Insulation: 1000MΩ Min. Khokahano...

CONN PLUG MICRO USB TYPE B solder T5.0 KLS1-235-0

Tlhahisoleseding ea Tlhahisoleseding ea Sehlahisoa: Bolulo: LCP+30%GF Tekanyetso ea ho Chesa:UL 94V-0 Black. Shell: Tšepe e se nang Mokelikeli. Mabitso:Mabitso a Brass Plating Gold Standard:Flash. Motlakase: Boemo ba Hona Joale: 0.5 Amp. Matla: 100 V AC / DC Max. Dielectric Withstanding: 500 V AC bakeng sa motsotso o le mong. Mocheso oa ho sebetsa: -55°C~+85°C Karolo ea No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. Taelo ya Nako

CONN MICRO USB 5P Mofuta oa Solder KLS1-4254

Boitsebiso ba Sehlahisoa Boitsebiso: Bolulo: Hight Temperature Plastic, UL94V-0,Black. Ikopanye le A:Brass T=0.20mm,Au Plated. Shell:Stainless Steel T=0.25mm, Ni Plated. Motlakase: 1. Tekanyetso ea Hona Joale: 1.0A(Signal PIN 2 3 4); 1.8A (Power PIN 1 5) 2.Contact Resistance:40mΩ Max. 3.Insulation Resistance:100MΩ Min. 4.Dielectric Withstanding: 100V AC Min. 5.Durability:10000 lipotoloho. 6.Sehokelo Mating matla:35N Max (3.57Kgf). 7.Co...

CONN MICRO USB 5P Clip mofuta 1.0mm KLS1-4253

Boitsebiso ba Boitsebiso ba Sehlahisoa: Insulation Material Thermoplastic. Shell: Alloy ea koporo / SPCC, T = 0.30mm. Plating: Nickel. Theminale: Alloy ea Koporo, T=0.25mm. Ho roala: Khauta/Tin e entsoeng. Motlakase: Insulation Resistance:1000MΩ Min. Khokahano ea ho Kopana: 30mΩ Max. Matla a Matla: 500 V AC. Litšobotsi tsa Mechini: Matla a Kenyelletso:3.5kgf Max. Matla a ho Ntša:1.02kgf Min. Karolo ea No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. Taelo ya Nako

CONN MICRO USB 5P Clip mofuta oa 0.8mm KLS1-4252

Lintlha tsa Tlhahisoleseding ea Sehlahisoa: 1.Tekanyetso ea Hona Joale:1.0A(Signal PIN 2 3 4); 1.8A (Power PIN 1 5) 2.Contact Resistance:40mΩ Max. 3.Insulation Resistance:100MΩ Min. 4.Dielectric Withstanding: 100 V AC Min. 5.Durability:10000 lipotoloho. 6.Sehokelo Mating matla:35N Max (3.57Kgf). 7.Sehokahanyi sa matla a ho se kopane:8N Min (0.30Kgf). 8.Sehlahisoa se Kopane le Kopo ea Karolo ea RoHS No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. Ke...

CONN MICRO USB 2P DIP KLS1-4251

Bolulo ba Boitsebiso ba Tlhahisoleseding ea Sehlahisoa: Thermoplastics ea mocheso oa Hing, e Ntšo. Kopana le: Copper Alloy C1591. Shell: Alloy ea koporo C2680/SPCC. Qetella: Kopana le: Khauta e Peliloeng sebakeng sa Mating;Tin On Solder Talls. Shell:Nickel Plating. Motlakase: Boemo ba Hona Joale: 1.5A/Contact Terminal. Tekanyetso ea Voltage: 30V DC Contact Resistance: 30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Khanyetsano ea Insulation: 1000MΩ Min. Connector Mate le Unmated Force Mate Bakeng sa...

CONN MICRO USB 2P R/A DIP KLS1-4250

Bolulo ba Boitsebiso ba Tlhahisoleseding ea Sehlahisoa: Thermoplastics ea mocheso oa Hing, e Ntšo. Kopana le: Copper Alloy C1591. Shell: Alloy ea koporo C2680/SPCC. Qetella: Kopana le: Khauta e Peliloeng sebakeng sa Mating;Tin On Solder Talls. Shell:Nickel Plating. Motlakase: Boemo ba Hona Joale: 1.5A/Contact Terminal. Tekanyetso ea Voltage: 30V DC Contact Resistance: 30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Khanyetsano ea Insulation: 1000MΩ Min. Connector Mate le Unmated Force Mate Bakeng sa...

CONN RCPT 5POS MICRO USB DIP 7.2mm KLS1-4248

Thepa ea Thermoplastic ea Hing e nang le GF,UL94V-0,Black. Khokahano: Alloy ea Koporo,t=0.15mm. Shell: Alloy ea koporo,t=0.30mm. Motlakase: Boemo ba Hona Joale: 1A Max. Dielectric Withstanding Voltage: 100 V AC bakeng sa 1 min. Khahlano ea ho Kopana: 50mΩ Max. Khanyetsano ea Insulation: 100MΩ Min. Kakaretso ea Matla a Mating:3.57 kgf Max. Kakaretso ea Matla a sa Kopaneng: 1.0 kgf Min. Sebaka sa Mocheso: -30°C Ho ea Ho +80°C Karolo ea No. Descr...

CONN RCPT 5POS MICRO USB DIP 7.2mm KLS1-4247

Tlhahisoleseding ea Sehlahisoa Material Housing: Hing Temperature Thermoplastic le GF,UL94V-0,Black Contact: Copper Alloy,t=0.20mm. Shell: Alloy ea koporo,t=0.25mm. Motlakase: Boemo ba Hona Joale: 1A Max. Dielectric Withstanding Voltage: 100 V AC bakeng sa 1 min. Khahlano ea ho Kopana: 50mΩ Max. Khanyetsano ea Insulation: 100MΩ Min. Kakaretso ea Matla a Mating:3.57 kgf Max. Kakaretso ea Matla a sa Kopaneng: 1.0 kgf Min. Mocheso Range: -30°C Ho ea Ho +80°C Karolo No. Des...

CONN RCPT 5POS MICRO USB DIP 5.9mm KLS1-4245

Thepa ea Thermoplastic ea Hing, UL94V-0 LCP,Black. Kopana le: Copper Alloy C2680. Shell: Alloy ea koporo C2680. Qetella: Iteanye le:Plated Khauta Sebakeng Mating; Tin On Solder Talls. Shell:Nickel Plating. Motlakase: Boemo ba Hona Joale: 1.0A/Contact Terminal. Tekanyetso ea Voltage: 30V DC Contact Resistance: 50mΩ Max. Dielectric Withstanding Voltage: 300 V AC AT Sea Level. Khanyetsano ea Insulation: 100MΩ Min. Sehokedi...

CONN RCPT 5POS MICRO USB SMD KLS1-4244

Thepa ea Thermoplastic ea Hing, UL94V-0 LCP,Black. Kopana le: Copper Alloy C5191. Shell: Alloy ea koporo C2680. Qetella: Iteanye le:Plated Khauta Sebakeng Mating; Tin On Solder Talls. Shell:Nickel Plating. Motlakase: Boemo ba Hona Joale: 1.0A/Contact Terminal. Tekanyetso ea Voltage: 30V DC Contact Resistance: 50mΩ Max. Dielectric Withstanding Voltage: 300 V AC AT Sea Level. Khanyetsano ea Insulation: 100MΩ Min. Sehokedi...
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