Sehokelo sa Nano SIM Card,6Pin,H1.4mm,Mofuta o Hinged,ntle le CD Pin KLS1-SIM-077
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Nano SIM Card,6Pin,H1.4mm, Mofuta o Hinged, ntle le CD Pin Material: Insulator:Mocheso o Phahameng Thermoplastic,UL94V-0. Contact:C5210,Plated 50u" Ni Kakaretso Ikopanye le Tsohle Au 1U. Shell:SUS.All Ni 30U / MIN. Motlakase: Tekanyetso ea Hona joale: 0.5A Voltage Rating:5V AC/DC Ambient Humidity Range:95% RH Max. Contact Resistance:80mΩ0. Insulation DC1/M Max. Cycles:10000 Insertions.Mocheso oa ho sebetsa: -45&...
Sehokelo sa Nano SIM Card,PUSH PULL,6Pin,H1.4mm,ka CD Pin KLS1-SIM-092
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Nano SIM Card,PUSH PULL,6Pin,H1.4mm,ka CD Pin Material: Housing:Hi-Temperature Thermoplastic,UL94V-0.Black. Terminal:Copper Alloy,selective 1u" Au sebakeng seo ho ka kopanang le sona. Shell:Stainless Steel.selective Gold Flash sebakeng sa solder. Motlakase: Rated current:0.5A Max Rated Voltage:30V AC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ0 Motlakase oa DC500 Motlakase oa DC500 Motlakase oa DC: AC/metsotso e tšoarellang: 5000...
Sehokelo sa Nano SIM Card;PUSH PULL,6Pin,H1.35mm KLS1-SIM-076
Lintlha tsa Sehlahisoa Sehokelo sa Nano SIM Card;PUSH PULL,6Pin,H1.35mm Material: Insulator:Mocheso o Phahameng Thermoplastic,UL94V-0. Ikopanye:C5210.Plated 50u" Ni Kakaretso,Ikopanye le Bohle Au 1u. Shell:SUS,Plated 50u" Ni Kakaretso,PAD Au 1u. Motlakase: Boemo ba Hona Joale: 0.5A AC/DC max. Tekanyetso ea Voltage: 125V AC/DC Khahlano ea Kopana: 100mΩ Max. Insulation Resistance:1000MΩ Min.500V DCOperating Mocheso: -45ºC~+85ºC Karolo ea No. Tlhaloso...
Sehokelo sa Micro SIM Card,8Pin H1.5mm, Mofuta o Hinged KLS1-SIM-089
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card,8Pin H1.5mm, Mofuta o Hinged Material Housing:Thermoplastic,UL94V-0. Theminale:Phosphor Bronze,T=0.15,NiPlated Under,Au Plated On ContactArea,G/F E Nang le Soldertail. Shell:Stainless Steel,T=0.15,Ni PlatedUnder,G/F E Patiloeng Ka Soldertail. Khahlano ea Khokahano ea Motlakase: 60mΩ Max. Khanyetsano ea Insulation: 1000MΩ Min. Dielectric Withstanding Voltage: 500V AC For1 Minute. Durability:5000 Cycles.Mocheso oa ho sebetsa: ...
Sehokelo sa Micro SIM Card,6Pin H1.8mm,Mofuta o Hinged KLS1-SIM-072
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card,6Pin H1.8mm, Mofuta o Hinged Material: Bolulo:LCP,UL94V-0,Black. Terminal: Alloy ea koporo. Shell: Tšepe e se nang Mokelikeli. Motlakase: Boemo ba Hona Joale: 1A Max. Tekanyetso ea matla: 30V DC max. Khokahano ea ho Kopana: 30mΩ Max. Khanyetsano ea Insulation: 1000MΩ Min. Matla a Dielectric: 500V rms / min. Durability:5000 Cycles.Mocheso oa ho sebetsa: -45ºC~+85ºC Karolo ea No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. ...
Sehokelo sa Micro SIM Card,6Pin H1.5mm,Tray mofuta KLS1-SIM-075
Tlhahisoleseding ya Sehlahiswa Sehokelo sa Micro SIM Card,6Pin H1.5mm,Tray mofuta Material: Insulator:Hi–Temperature Plastic,UL94V-0,Black. Terminal:Copper Alloy.Gold Flash Plating on alterminal,Aad 50u" min Nickel E kentsoe holim'a allover. Shell:50u" Nickel E kentsoe holim'a allover,Gold flash onnsolder pad. Motlakase: Tekanyetso ea Hona Joale: 0.5A Voltage Rating Voltage: 5.0 vrms Insulation Resistance: 1000MΩ Min./500V DC E mamellang Voltage: 250V ACrms Bakeng sa 1Minute ...
Sehokelo sa Micro SIM Card,6P,PUSH PULL,H1.5mm KLS1-SIM-099
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card,6P,PUSH PULL,H1.5mm Material Housing:Thermoplastic,UL94V-0. Terminal: Copper Alloy, Khauta e Apehiloeng sebakeng sa ContactArea le Solder Tails,Nickel Plated Kakaretso. Shell:Stainless Steel.Nickel e Plated Ka Kakaretso.GoldPlated On Solder Tails. Motlakase: Boemo ba Hona Joale: 1.0 A max. Khokahano ea ho Kopana: 30mΩ Max. Dielectric Withstanding Voltage: 500V AC Insulation Resistance:1000MΩ Min./500V DC Mocheso oa ho sebetsa: -45ºC~+8...
Sehokelo sa Micro SIM Card,8P,PUSH PULL,H1.5mm KLS1-SIM-091
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card, 8P,PUSH PULL,H1.5mm Motlakase: E Lekanyelitsoe Hona Joale: 1.0A E Lekanyelitsoe Matla: 30V Ho hanyetsa ho Kopana: 50mΩ Max. Insulation Resistance:1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC Solder abiltiy:250oC~%%P5oC,10%%P0.5s Durability:5000 Cycles Min.Contact Resistance:50mº4 Temperature+Cº5 Part5 Max. No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. Nako O...
Sehokelo sa Micro SIM Card,6P,H1.45mm KLS1-SIM-046
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card,6P,H1.45mm Boitsebiso: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal:Copper Alloy,50u" min Nickel e kentsoe ka tlas'a onallover,gole plated allover. Motlakase: Tekanyetso ea Hona Joale: 0.5 A Voltage Rating: 5.0 V Insulation Resistance: 500MΩ Min./500V DC E mamella Voltage: 250V AC Bakeng sa 1 motsotso. Khokahano ea ho Kopana: 100mΩ ...
Sehokelo sa Micro SIM Card, 6P
Sehokelo sa Micro SIM Card, 6P
Sehokelo sa Micro SIM Card,8P
Sehokelo sa Micro SIM Card,8P
Sehokelo sa Micro SIM Card,8P
Sehokelo sa Micro SIM Card, 6P
P-H1.5-R )
Sehokelo sa Micro SIM Card;PUSH PUSH,6P+1P Kapa 8P+1P,H1.50mm KLS1-SIM-090
Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm KLS1-SIM-069
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm, Ntle le poso. Boitsebiso: Insulator:High TemperatureThermoplastic,UL94V-0 Contact: Copper Alloy,Plated 50U" NiOverall Contact Au 1U Shell:SUS,Plated 50U" Ni Overall Plated 1u"Au Selective Contact Area Electrical: Current Rating: 0.5A Max. Insulation Resistance:1000M Min./500VDC Ambient Humidity Range:95% RH Ma...
Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm KLS1-SIM-044-8P
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm Boitsebiso: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Khokahano ea Boitsebiso: Copper Alloy, Gold Plated. Shell:Stainless Steel,Gold Plated. Motlakase: Khahlano ea ho Kopana: 50mΩ e tloaelehileng, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Mohato oa Mouoane:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ho soasoa ka letsoho: 370ºC.3sec.Max. Mocheso oa ho sebetsa: -45ºC~+105&o...
Sehokelo sa Micro SIM Card 6P,PUSH PULL,H2.4mm KLS1-SIM-044-6P
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card 6P,PUSH PULL,H2.4mm Boitsebiso: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Khokahano ea Boitsebiso: Copper Alloy, Gold Plated. Shell:Stainless Steel,Gold Plated. Motlakase: Khahlano ea ho Kopana: 50mΩ e tloaelehileng, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Mohato oa Mouoane:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ho soasoa ka letsoho: 370ºC.3sec.Max. Mocheso oa ho sebetsa: -45ºC~+105&o...
Sehokelo sa SIM Card;PUSH PUSH,6P+2P,H1.80mm,Ka poso kapa Ntle le poso. KLS1-SIM-110
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card;PUSH PUSH,6P+2P,H1.80mm Ka poso kapa Ntle le poso.Material: Material ea Ntlo: LCP UL94V-0Contact Material: Tin-BronzePackage: Theipi le Reel PackageLitšobotsi tsa Motlakase: Tekanyetso ea Voltage: 100VV rating 250V AC/1MinuteInsulation resistance: ≥1000ΜΩHo hanyetsana le: ≤30mΩBophelo:
Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.9mm,ka Post KLS1-SIM-108
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.9mm,ka poso Material: Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: Alloy ea koporo. Plating: Sebaka sa Kopano: Khauta ea flash. Sebaka sa Solder: 80u" Min, Matte tin alloy plated. Tlas'a poleiti: 30u "min, Nickel. Shell:30u" Min,Nickel plated generalSebaka sa Solder:Gole flash.Motlakase: Tekanyetso ea Hona joale:0.5A. Ho mamella Voltage:AC500V rms Insulation Resistance:1000MΩMin,At DC 500V ...
Sehokelo sa SIM Card,PUSH PUSH,6P+1P,H1.9mm,ka Post KLS1-SIM-107
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P+1P,H1.9mm,e nang le Boitsebiso ba Post: Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: Alloy ea koporo / tšepe. Plating: Sebaka sa Kopano: Khauta ea flash. Sebaka sa Solder: 80u" Min, Matte tin alloy plated. Tlas'a poleiti: 30u "min, Nickel. Shell:30u" Min,Nickel plated general area Solder:Gole flash.Motlakase: Tekanyetso ea Hona Joale:0.5A. Withstanding Voltage:AC500V rms Insulation Resistance:1000MΩMin,At...
Sehokelo sa SIM Card;PUSH PUSH,6P,H1.85mm KLS1-SIM-106
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm,e nang le Post Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: SUS. Qetella: Khauta e pentiloeng sebakeng sa conatct, Tin e kentsoeng mehatleng ea solder. Karolo ea No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. Taelo ya Nako
Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Post KLS1-SIM-087
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated ho Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash on Solder Latch. Motlakase: Current Rating:0.5A. Voltage Rating:5.0 Vrms. Insulation Resist...- English
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