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Lihokelo tsa SIM card & Lihokelo tsa Micro SIM card & Lihokelo tsa Nano SIM Card

Sehokelo sa Micro SIM Card,6Pin H1.42mm KLS1-SIM-105

Lintlha tsa Sehlahisoa Sehokelo sa Micro SIM Card,6Pin H1.42mm Material: Insulator:High Temperature Thermoplastic,UL 94V-0 Contact: Copper Alloy,Plated 50u” Ni Ooverall Contact Au 1U Shell:SUS,Plated 50u” Ni Ooverall,Plated 1u ea Motlakase tekanyo: 0.5mA AC/DC max tekanyo ea Voltage: 125V AC/DC Ambient Mocheso Range:-20°C~+60°C Storage Mocheso Range:-40°C~+70°C Ambient Humidity Range:95% RH max Contact resi...

Micro SIM Card CONN,6P,H1.45mm,SMD KLS1-SIM-046

Litšoantšo tsa Sehlahisoa Boitsebiso Bohlokoa: Bolulo: LCP,UL94V-0 Ikopanye:C5210 , Khauta ea Flash Plated Holong ea Kopano; Khauta Flash Plating Ka Mehatla Solder; With Entrre Contact Underplated Nickel Shell:SUS304,Nickel Underplated Holim'a Tsohle, Gold Flash Plated On Solder Tails Motlakase Litlhaloso: Hajoale Rating:0.5A Voltage Rating:5V Contact Resistance:50mΩ Max. Insulation resistance:1000MΩ Min Durabiliy:3000 Cycles Min

Sehokelo sa Micro SIM Card,8Pin H1.5mm, Mofuta o Hinged KLS1-SIM-089

Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card,8Pin H1.5mm, Mofuta o Hinged Material Housing:Thermoplastic,UL94V-0. Theminale:Phosphor Bronze,T=0.15,Ni Plated Under,Au E Alalitsoe Sebakeng sa Khokahano,G/F E Alamiloe Ka Soldertail. Shell:Stainless Steel,T=0.15,Ni Plated Under,G/F E Patiloeng Ka Soldertail. Khahlano ea Khokahano ea Motlakase: 60mΩ Max. Khanyetsano ea Insulation: 1000MΩ Min. Dielectric Withstanding Voltage: 500V AC Bakeng sa 1 Motsotso. Durability:5000 Cycles. Mocheso oa ho sebetsa: -45ºC ~ +85ºC

Sehokelo sa Micro SIM Card,6Pin H1.8mm,Mofuta o Hinged KLS1-SIM-072

Lits'oants'o tsa Sehlahisoa Sehokelo sa Micro SIM Card,6Pin H1.8mm,Mofuta oa Hinged Material: Bolulo:LCP,UL94V-0,Black. Terminal: Alloy ea koporo. Shell: Tšepe e se nang Mokelikeli. Motlakase: Boemo ba Hona Joale: 1A Max. Tekanyetso ea matla: 30V DC max. Khokahano ea ho Kopana: 30mΩ Max. Khanyetsano ea Insulation: 1000MΩ Min. Matla a Dielectric: 500V rms / min. Durability:5000 Cycles. Mocheso oa ho sebetsa: -45ºC ~ +85ºC

Sehokelo sa Micro SIM Card,6Pin H1.5mm,Tray mofuta KLS1-SIM-075

Lits'oants'o tsa Sehlahisoa Sehokelo sa Micro SIM Card,6Pin H1.5mm,Tray mofuta Material: Insulator:Hi–Temperature Plastic,UL94V-0,Black. Theminale:Copper Alloy.Gold Flash Plating on all terminal,Aad 50u” min Nickel E kentsoe ka holim'a allover. Motlakase: Tekanyetso ea Hona Joale: 0.5A Voltage Rating Voltage:5.0 vrms Insulation Resistance:1000MΩ Min./500V DC Withstanding Voltage:250V ACrms For 1Minute Contact Res...

Sehokelo sa Micro SIM Card,6P,PUSH PULL,H1.5mm KLS1-SIM-099

Lits'oants'o tsa Sehlahisoa Sehokelo sa Micro SIM Card,6P,PUSH PULL,H1.5mm Material Housing:Thermoplastic,UL94V-0. Terminal: Copper Alloy, Khauta e Apehiloeng sebakeng sa Kopano le Mehatla ea Solder,Nickel e Nang le Kakaretso. Shell:Stainless Steel.Nickel e Plated Ka Kakaretso.GoldPlated On Solder Tails. Motlakase: Boemo ba Hona Joale: 1.0 A max. Khokahano ea ho Kopana: 30mΩ Max. Dielectric Withstanding Voltage: 500V AC Insulation Resistance:1000MΩ Min./500V DC Mocheso oa ho sebetsa: -45ºC~+85ºC

Sehokelo sa Micro SIM Card,8P,PUSH PULL,H1.5mm KLS1-SIM-091

Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card,8P,PUSH PULL,H1.5mm Motlakase: E Lekanyelitsoe Hona Joale:1.0A Lebelo la Matla:30V Ho hanyetsana le Kopana:50mΩ Max. Insulation Resistance:1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC Solder abiltiy:250oC~%%P5oC,10%%P0.5s Durability:5000 Cycles Min. Khahlano ea ho Kopana: 50mΩ Max. Mocheso oa ho sebetsa: -45ºC ~ +85ºC

Sehokelo sa Micro SIM Card, 6P

Litšoantšo tsa Sehlahisoa

Sehokelo sa Micro SIM Card, 6P

Litšoantšo tsa Sehlahisoa

Sehokelo sa Micro SIM Card,8P

Litšoantšo tsa Sehlahisoa

Sehokelo sa Micro SIM Card,8P

Litšoantšo tsa Sehlahisoa

Sehokelo sa Micro SIM Card,8P

Litšoantšo tsa Sehlahisoa

Sehokelo sa Micro SIM Card, 6P

Litšoantšo tsa Sehlahisoa

Sehokelo sa Micro SIM Card;PUSH PUSH,6P+1P Kapa 8P+1P,H1.50mm KLS1-SIM-090

Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Micro SIM Card;PUSH PUSH,6P +1P Kapa 8P + 1P,H1.50mm Tekanyetso ea Hona Joale ea Motlakase: 0.5A Voltage Rating: 5.0 vrms Ho hanyetsa ho kopana: 100mΩ Max. Insulation resistance: 1000M Min. Ho mamella Voltage: 250V ACrms Bakeng sa Motsotso o le mong. Operating TempRange:-45℃-+105℃ Material: Insulator:Hi-Temperature plastic,UL94V-0,Black Terminal:Copper Alloy,Gold Flash Plating On All Terminal, Le 50u” min nickel e kentsoe ka tlas'a allover.Shell:Stainless Steel,50u&...

Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm KLS1-SIM-069

Lintlha tsa Sehlahisoa Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm,Ntle le poso. Material: Insulator:High Temperature Thermoplastic,UL94V-0 Contact: Copper Alloy,Plated 50U” Ni Overall Contact Au 1U Shell:SUS,Plated 50U” Ni Overall Plated 1u” Au Selective Contact Area Motlakase: Current Rating: 0.5A Max. Khanyetso:1000M Min./500VDC Ambient Humidity Range:95% RH Max Mati.

Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm KLS1-SIM-044-8P

Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm Material: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Khokahano ea Boitsebiso: Copper Alloy, Gold Plated. Shell:Stainless Steel,Gold Plated. Motlakase: Khahlano ea ho Kopana: 50mΩ e tloaelehileng, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Mohato oa Mouoane:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ho soasoa ka letsoho: 370ºC.3sec.Max. Mocheso oa ho sebetsa: -45ºC ~+105ºC

Sehokelo sa Micro SIM Card 6P,PUSH PULL,H2.4mm KLS1-SIM-044-6P

Lits'oants'o tsa Lihlahisoa Tlhahisoleseling ea Sehlahisoa Sehokelo sa Micro SIM Card 6P,PUSH PULL,H2.4mm Material: Base: Hi-Temp Thermoplastic,UL94V-0.Black. Khokahano ea Boitsebiso: Copper Alloy, Gold Plated. Shell:Stainless Steel,Gold Plated. Motlakase: Khahlano ea ho Kopana: 50mΩ e tloaelehileng, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Mohato oa Mouoane:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ho soasoa ka letsoho: 370ºC.3sec.Max. Mocheso oa ho sebetsa: -45ºC ~+105ºC

Sehokelo sa SIM Card;PUSH PUSH,6P+2P,H1.80mm,Ka poso kapa Ntle le poso. KLS1-SIM-110

Litšoantšo tsa Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card;PUSH PUSH,6P+2P,H1.80mm Ka poso kapa Ntle le poso. Boitsebiso: Boitsebiso ba Bolulo: LCP UL94V-0 Boitsebiso ba ho Kopana: Sephutheloana sa Tin-Bronze: Theipi le Reel Package Litšobotsi tsa Motlakase: Tekanyo ea Voltage: 100V AC Tekanyetso ea Hona joale: 0.5A Max Mamella matla: 250V AC/1Minute Insulation resistance0: ≩1Minute Insulation resistance0: ≩1 Ho hanyetsa ≩0 ≩1 Bophelo: ~5000 Cycles Mocheso oa ho sebetsa: -45ºC ~+85ºC

Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.9mm,ka Post KLS1-SIM-108

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,8P+1P,H1.9mm, e nang le Boitsebiso ba Post: Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: Alloy ea koporo. Plating: Sebaka sa Kopano: Khauta ea flash. Sebaka sa Solder:80u" Min, Matte tin alloy plated. Under plate:30u" min,Nickel. Shell:30u” Min,Nickel plated general Sebaka sa Solder:Gole flash.Motlakase: Tekanyetso ea hajoale:0.5A.Ho mamella Voltage:AC500V rms Insulation Resistance:1000MΩMin,At DC 500V Contact R...

Sehokelo sa SIM Card,PUSH PUSH,6P+1P,H1.9mm,ka Post KLS1-SIM-107

Litšoantšo tsa Tlhahiso ea Tlhahiso ea Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P+1P,H1.9mm, ka Post Material: Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: Alloy ea koporo / tšepe. Plating: Sebaka sa Kopano: Khauta ea flash. Sebaka sa Solder:80u" Min, Matte tin alloy plated. Under plate:30u" min,Nickel. Shell:30u” Min,Nickel plated general Sebaka sa Solder:Gole flash.Motlakase: Tekanyetso ea Hona Joale:0.5A.Ho mamella Voltage:AC500V rms Insulation Resistance:1000MΩMin,At DC 500V Cot...

Sehokelo sa SIM Card;PUSH PUSH,6P,H1.85mm KLS1-SIM-106

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P,H1.85mm, ka Post Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: SUS. Qetella: Khauta e pentiloeng sebakeng sa conatct, Tin e kentsoeng mehatleng ea solder.

Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Post KLS1-SIM-087

Litšoantšo tsa Tlhahiso ea Tlhahiso ea Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel e Underplated on Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u” Nickel e kentsoe ka tlas'a Allover,Gold Flash on Solder Latch.Motlakase: Hajoale Rating:0.5A. Voltage Rating:5.0 Vrms. Insulation Resistance:500...

Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Post KLS1-SIM-086

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel e Underplated on Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u” Nickel e kentsoe ka tlas'a Allover,Gold Flash on Solder Latch.Motlakase: Boemo ba Hona Joale:0.5A. Voltage Rating:5.0 Vrms.

Sehokelo sa SIM Card,PUSH PUSH,8P+2P,H1.85mm, ntle le Post KLS1-SIM-085A

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,8P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel e Underplated on Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u” Nickel e kentsoe ka tlas'a Allover,Gold Flash on Solder Latch.Motlakase: Boemo ba Hona Joale:0.5A. Voltage Rating:5.0 Vrms.
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