Sehokelo sa Micro SIM Card,8P,PUSH PULL,H1.5mm KLS1-SIM-091
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card, 8P,PUSH PULL,H1.5mm Motlakase: E Lekanyelitsoe Hona Joale: 1.0A E Lekanyelitsoe Matla: 30V Ho hanyetsa ho Kopana: 50mΩ Max. Insulation Resistance:1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC Solder abiltiy:250oC~%%P5oC,10%%P0.5s Durability:5000 Cycles Min.Contact Resistance:50mº4 Temperature+Cº5 Part5 Max. No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. Nako O...
Sehokelo sa Micro SIM Card,6P,H1.45mm KLS1-SIM-046
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card,6P,H1.45mm Boitsebiso: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal:Copper Alloy,50u" min Nickel e kentsoe ka tlas'a onallover,gole plated allover. Motlakase: Tekanyetso ea Hona Joale: 0.5 A Voltage Rating: 5.0 V Insulation Resistance: 500MΩ Min./500V DC E mamella Voltage: 250V AC Bakeng sa 1 motsotso. Khokahano ea ho Kopana: 100mΩ ...
Sehokelo sa Micro SIM Card, 6P
Sehokelo sa Micro SIM Card, 6P
Sehokelo sa Micro SIM Card,8P
Sehokelo sa Micro SIM Card,8P
Sehokelo sa Micro SIM Card,8P
Sehokelo sa Micro SIM Card, 6P
P-H1.5-R )
Sehokelo sa Micro SIM Card;PUSH PUSH,6P+1P Kapa 8P+1P,H1.50mm KLS1-SIM-090
Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm KLS1-SIM-069
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm, Ntle le poso. Boitsebiso: Insulator:High TemperatureThermoplastic,UL94V-0 Contact: Copper Alloy,Plated 50U" NiOverall Contact Au 1U Shell:SUS,Plated 50U" Ni Overall Plated 1u"Au Selective Contact Area Electrical: Current Rating: 0.5A Max. Insulation Resistance:1000M Min./500VDC Ambient Humidity Range:95% RH Ma...
Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm KLS1-SIM-044-8P
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm Boitsebiso: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Khokahano ea Boitsebiso: Copper Alloy, Gold Plated. Shell:Stainless Steel,Gold Plated. Motlakase: Khahlano ea ho Kopana: 50mΩ e tloaelehileng, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Mohato oa Mouoane:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ho soasoa ka letsoho: 370ºC.3sec.Max. Mocheso oa ho sebetsa: -45ºC~+105&o...
Sehokelo sa Micro SIM Card 6P,PUSH PULL,H2.4mm KLS1-SIM-044-6P
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card 6P,PUSH PULL,H2.4mm Boitsebiso: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Khokahano ea Boitsebiso: Copper Alloy, Gold Plated. Shell:Stainless Steel,Gold Plated. Motlakase: Khahlano ea ho Kopana: 50mΩ e tloaelehileng, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Mohato oa Mouoane:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ho soasoa ka letsoho: 370ºC.3sec.Max. Mocheso oa ho sebetsa: -45ºC~+105&o...
Sehokelo sa SIM Card;PUSH PUSH,6P+2P,H1.80mm,Ka poso kapa Ntle le poso. KLS1-SIM-110
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card;PUSH PUSH,6P+2P,H1.80mm Ka poso kapa Ntle le poso.Material: Material ea Ntlo: LCP UL94V-0Contact Material: Tin-BronzePackage: Theipi le Reel PackageLitšobotsi tsa Motlakase: Tekanyetso ea Voltage: 100VV rating 250V AC/1MinuteInsulation resistance: ≥1000ΜΩHo hanyetsana le: ≤30mΩBophelo:
Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.9mm,ka Post KLS1-SIM-108
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.9mm,ka poso Material: Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: Alloy ea koporo. Plating: Sebaka sa Kopano: Khauta ea flash. Sebaka sa Solder: 80u" Min, Matte tin alloy plated. Tlas'a poleiti: 30u "min, Nickel. Shell:30u" Min,Nickel plated generalSebaka sa Solder:Gole flash.Motlakase: Tekanyetso ea Hona joale:0.5A. Ho mamella Voltage:AC500V rms Insulation Resistance:1000MΩMin,At DC 500V ...
Sehokelo sa SIM Card,PUSH PUSH,6P+1P,H1.9mm,ka Post KLS1-SIM-107
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P+1P,H1.9mm,e nang le Boitsebiso ba Post: Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: Alloy ea koporo / tšepe. Plating: Sebaka sa Kopano: Khauta ea flash. Sebaka sa Solder: 80u" Min, Matte tin alloy plated. Tlas'a poleiti: 30u "min, Nickel. Shell:30u" Min,Nickel plated general area Solder:Gole flash.Motlakase: Tekanyetso ea Hona Joale:0.5A. Withstanding Voltage:AC500V rms Insulation Resistance:1000MΩMin,At...
Sehokelo sa SIM Card;PUSH PUSH,6P,H1.85mm KLS1-SIM-106
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm,e nang le Post Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: SUS. Qetella: Khauta e pentiloeng sebakeng sa conatct, Tin e kentsoeng mehatleng ea solder. Karolo ea No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. Taelo ya Nako
Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Post KLS1-SIM-087
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated ho Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash on Solder Latch. Motlakase: Current Rating:0.5A. Voltage Rating:5.0 Vrms. Insulation Resist...
Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Post KLS1-SIM-086
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated ho Allover,GoldPlating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel e kentsoe ka tlas'a Allover,Gold Flash onSolder Latch.Motlakase: Boemo ba Hona Joale:0.5A. Voltage Rating:5.0 Vrms. Insulation Resis...
Sehokelo sa SIM Card,PUSH PUSH,8P+2P,H1.85mm, ntle le Post KLS1-SIM-085A
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,8P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-TemperaturePlastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u" Nickel e kentsoe ka tlas'a Allover,GoldFlash on Solder Latch.Motlakase: Tekanyetso ea Hona Joale:0.5A. Voltage Rating:5.0 Vrms. Insulation Resist...
Sehokelo sa SIM Card,PUSH PUSH,8P+2P,H1.85mm, ntle le Post KLS1-SIM-085
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,8P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated onAllover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,GoldFlash on Solder Latch.Motlakase: Hajoale Rating:0.5A. Voltage Rating:5.0 Vrms. Insulation Resi...
Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Post KLS1-SIM-084
Tlhahisoleseding ya Sehlahiswa Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm,ntle le Sesebediswa sa Poso: Bolulo:LCP,UL94V-0 Contact:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester.OperatingFlashºCtemperature:+5OperatingFºGold Finish:+5OperatingFºGold Mocheso: Sebaka;Gold Flash Plated On SolderTails,Ka Kopana Kahohle Ka tlase ho 50u" min Nickel. Shell:50u" min Nickel e Tlatselitsoe Ka Kakaretso, Khauta e Nang le Mehatla e Solder. Karolo ea No. Tlhaloso PC...
Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm,ntle le Post KLS1-SIM-074B
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm, ntle le Boitsebiso ba Post: Bolulo:Mocheso o Phahameng Thermoplastic,UL94V-0.Black. Kopana le: Copper Alloy. Sekoahelo:Ikopanye: Li-alloys tsa Koporo Kapa Tšepe. Plating: Underplate:Nickel. Sebaka sa Kopano: Gold Over Nickel. Sebaka sa Solder: Tin Over Nickel. Shell:G/F Plate Over Nickel On Solder Tails Motlakase: Boemo ba Hona Joale:0.5A. Tekanyo ea matla: 5.0 Vrms. Insulation Resistance: 500M Min.At DC 500V DC E mamella Voltage: 250V A...
Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm, ntle le Post KLS1-SIM-074A
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-TemperaturePlastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u" Nickel e kentsoe ka tlas'a Allover,GoldFlash on Solder Latch.Motlakase: Hajoale Rating:0.5A. Voltage Rating:5.0 Vrms. Insulation Resistanc...
Sehokelo sa SIM Card, PUSH PUSH,6P,H1.85mm, e nang le Post and out Post KLS1-SIM-073A
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P,H1.85mm, ka Post and out Post Motlakase: Tekanyetso ea Hona Joale: 0.5A. Tekanyo ea matla: 5.0 Vrms. Insulation Resistance: 500M Min.At DC 500V DC Withstanding Voltage: 250V ACrms Bakeng sa 1 Motsotso. Kopana le Khanyetso: 100M Max.At 10MA/20mVMAX. Mocheso oa ho sebetsa: -45ºC~+85ºCMatingCycles:5000 Insertions. Lintho tse bonahalang: Insulator: H-Temperature Plastic, UL94V-0.Black. Khokahano: Alloy ea Koporo,T=0.15mm Shell:Stainless Steel,T=0.15...- English
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