Sehlahisoa

Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.9mm,ka Post KLS1-SIM-108

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,8P+1P,H1.9mm, e nang le Boitsebiso ba Post: Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: Alloy ea koporo. Plating: Sebaka sa Kopano: Khauta ea flash. Sebaka sa Solder:80u" Min, Matte tin alloy plated. Under plate:30u" min,Nickel. Shell:30u” Min,Nickel plated general Sebaka sa Solder:Gole flash.Motlakase: Tekanyetso ea hajoale:0.5A.Ho mamella Voltage:AC500V rms Insulation Resistance:1000MΩMin,At DC 500V Contact R...

Sehokelo sa SIM Card,PUSH PUSH,6P+1P,H1.9mm,ka Post KLS1-SIM-107

Litšoantšo tsa Tlhahiso ea Tlhahiso ea Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P+1P,H1.9mm, ka Post Material: Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: Alloy ea koporo / tšepe. Plating: Sebaka sa Kopano: Khauta ea flash. Sebaka sa Solder:80u" Min, Matte tin alloy plated. Under plate:30u" min,Nickel. Shell:30u” Min,Nickel plated general Sebaka sa Solder:Gole flash.Motlakase: Tekanyetso ea Hona Joale:0.5A.Ho mamella Voltage:AC500V rms Insulation Resistance:1000MΩMin,At DC 500V Cot...

Sehokelo sa SIM Card;PUSH PUSH,6P,H1.85mm KLS1-SIM-106

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P,H1.85mm, ka Post Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: SUS. Qetella: Khauta e pentiloeng sebakeng sa conatct, Tin e kentsoeng mehatleng ea solder.

Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Post KLS1-SIM-087

Litšoantšo tsa Tlhahiso ea Tlhahiso ea Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel e Underplated on Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u” Nickel e kentsoe ka tlas'a Allover,Gold Flash on Solder Latch.Motlakase: Hajoale Rating:0.5A. Voltage Rating:5.0 Vrms. Insulation Resistance:500...

Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Post KLS1-SIM-086

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel e Underplated on Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u” Nickel e kentsoe ka tlas'a Allover,Gold Flash on Solder Latch.Motlakase: Boemo ba Hona Joale:0.5A. Voltage Rating:5.0 Vrms.

Sehokelo sa SIM Card,PUSH PUSH,8P+2P,H1.85mm, ntle le Post KLS1-SIM-085A

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,8P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel e Underplated on Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u” Nickel e kentsoe ka tlas'a Allover,Gold Flash on Solder Latch.Motlakase: Boemo ba Hona Joale:0.5A. Voltage Rating:5.0 Vrms.

Sehokelo sa SIM Card,PUSH PUSH,8P+2P,H1.85mm, ntle le Post KLS1-SIM-085

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,8P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel e Underplated on Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u” Nickel e kentsoe ka tlas'a Allover,Gold Flash on Solder Latch.Motlakase: Boemo ba Hona Joale:0.5A. Voltage Rating:5.0 Vrms.

Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Post KLS1-SIM-084

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P+2P,H1.85mm, ntle le Boitsebiso ba Post: Housing:LCP,UL94V-0 Contact:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester. Thempereichara ea ho Tšebetso: -45ºC~+85ºC Qetella: Kopana: Khauta e Phaletsoeng sebakeng sa Kopano;Letlapa la Khauta le Atetsoe Mohatleng oa Solder,Ka Khokahano E Feletseng e kentsoeng ka tlase ho 50u" min Nickel. Shell:50u" min Nickel e Tlatselitsoe Ka Kakaretso,Fleshe ea Khauta e Atetsoe Mehatleng e Solder.

Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm,ntle le Post KLS1-SIM-074B

Litšoantšo tsa Tlhahiso ea Tlhahiso ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm, ntle le Boitsebiso ba Post: Bolulo:Mocheso o Phahameng Thermoplastic,UL94V-0.Black. Kopana le: Copper Alloy. Sekoahelo: Ikopanye: Li-alloys tsa Koporo Kapa Tšepe. Plating: Underplate:Nickel. Sebaka sa Kopano: Gold Over Nickel. Sebaka sa Solder: Tin Over Nickel. Shell:G/F Plate Over Nickel On Solder Tails Motlakase: Boemo ba Hona Joale:0.5A. Tekanyo ea matla: 5.0 Vrms. Insulation Resistance: 500M Min.At DC 500V DC E mamella Voltage: 250V ACrms Bakeng sa 1 ...

Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm, ntle le Post KLS1-SIM-074A

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,8P+1P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel e Underplated on Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u” Nickel e kentsoe ka tlas'a Allover,Gold Flash on Solder Latch.Motlakase: Boemo ba Hona Joale:0.5A. Voltage Rating:5.0 Vrms.

Sehokelo sa SIM Card, PUSH PUSH,6P,H1.85mm, se nang le Post and out Post KLS1-SIM-073A

Lits'oants'o tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P,H1.85mm, ka Post and Out Post Motlakase: Tekanyetso ea Hona Joale: 0.5A. Tekanyo ea matla: 5.0 Vrms. Insulation Resistance: 500M Min.At DC 500V DC Withstanding Voltage: 250V ACrms Bakeng sa 1 Motsotso. Kopana le Khanyetso: 100M Max.At 10MA/20mV MAX. Thempereichara ea ho sebetsa: -45ºC~+85ºC Lipotoloho tsa ho Kopana:5000 tse kentsoeng. Lintho tse bonahalang: Insulator: H-Temperature Plastic, UL94V-0.Black. Khokahano: Alloy ea Koporo,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Termi...

Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Post KLS1-SIM-064A

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel e Underplated on Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u” Nickel e kentsoe ka tlas'a Allover,Gold Flash on Solder Latch.Motlakase: Boemo ba Hona Joale:0.5A. Voltage Rating:5.0 Vrms.

Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Post KLS1-SIM-030E

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P,H1.85mm, ntle le Boitsebiso ba poso: Bolulo: Hi-Temp Plastic, UL94V-0.Rated. Kopana le: Copper Alloy. Shell:Stainless Steel.SUS 301,T=0.20mm. Plating: Sebaka sa ho kopana: G / F E entsoeng ka holimo ho 30u "Sebaka sa Nickel Solder: 80u" Tin e entsoeng ka holimo ho 30u "Nickel. Tlas'a poleiti: 30u" Min Nickel. Shell:30u” Min,Nickel e Apehiloe ka Tsohle,Sebaka sa Solder:Gold Flash.Motlakase: Tekanyetso ea Hona Joale:0.5 A Dielectric Withstanding Voltage:250V A...

Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H2.25mm,ntle le Post KLS1-SIM-030A

Litšoantšo tsa Tlhahiso ea Tlhahiso ea Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P +2P,H2.25mm, ntle le Boitsebiso ba Post: Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell:Stainless Steel.SUS 301,T=0.20mm. Plating: Sebaka sa ho kopana: G / F E entsoeng ka holim'a 30u "Sebaka sa Nickel Solder: 80u" Tin e entsoeng ka holimo ho 30u "Nickel. Tlas'a poleiti: 30u" Min Nickel. Shell:30u” Min,Nickel Plated Over All,Solder Area:Gold Flash.Motlakase: Current Rating:0.5 A Dielectric Withstanding Voltage:250...

Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm KLS1-SIM-030-6P & KLS1-SIM-030-6P-1-R & KLS1-SIM-030-6P-3-R

Litšoantšo tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P+2P,H1.85mm Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm;Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel e Tlatselitsoe ho Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u” Nickel e kentsoe ka tlas'a Allover,Gold Flash on Solder Latch.Motlakase: Current Rating:0.5A Voltage Rating:5.0 Vrms. Insulation Resistance:500M Min.At DC...

Sehokelo sa SIM Card, PUSH PUSH,6P+2P & 8P+2P KLS1-SIM-014

Lits'oants'o tsa Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P+2P & 8P+2P Tlhahisoleseding ea Odara:KLS1-SIM-014-6P-R6P=6+2pin, 8P=8+2pinR=Roll pack Material: Thepa ea Ntlo: LCP UL94V-0Contact Material: Tin-Pack-Pack ea Motlakase Litšobotsi: Tekanyetso ea Voltage: 5V (AC.DC) MaxCurrent Rating: 10mA (AC.DC) MaxWithstand voltage: 500V AC/1MinuteInsulation resistance: ≥1000ΜΩ Min Ho 500V ACC...

Sehokelo sa 6P SIM Card,PUSH PULL,H2.6mm,ka CD Pin KLS1-SIM-078

Lits'oants'o tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa 6P Sehokelo sa Karete ea SIM,PUSH PULL,H2.6mm,ka CD Pin Order Information:KLS1-SIM-078-6P-H2.6-R Material:Phosphor Bronze. Kopana le: Copper Alloy. Kopana le: Khethang Khauta ea Khauta. Tekanyetso ea Hona Joale ea Voltage: 1 A 50V AC. Ikopanye le Matla a Matla: AC 500V Bakeng sa Motsotso o le Mong.

Sehokelo sa 6P SIM Card,PUSH PULL,H1.8mm KLS1-SIM-044C

Lits'oants'o tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa 6P SIM Card Connector,PUSH PULL,H1.8mm,Roll pack Order Information:KLS1-SIM-044C-6P-R Material: Housing:High Thermoplastic,UL94V-0.Black. Terminal: Alloy ea koporo. Shell: Alloy ea koporo. Qetella: Ikopanye le:Gold Over Nickel. Shell:Nickel ka Hohle. Motlakase: Matla a Ho sebetsa: 30V Tekanyetso ea Hona Joale: 0.5 A Mocheso oa ho Sebelisa: -45ºC ~+105ºC ...

Sehokelo sa 6P SIM Card,PUSH PULL,H2.2mm KLS1-SIM-044A

Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa 6P SIM Card Connector,PUSH PULL,H2.2mm Tlhahisoleseding ea Odara:KLS1-SIM-044A-6P-H2.2-RH2.2=Bophahamo 2.2mmR=Roll pack Material: Terminal: Copper Alloy. Qetella: Shell:Nickel Over All Over. Matla a sebetsang: 30V Mocheso oa ho sebetsa: -45ºC ~+105ºC

Sehokelo sa 6P SIM Card,PUSH PULL,H1.7mm KLS1-SIM-015B

Lintlha tsa Sehlahisoa mabapi le Sehokelo sa 6P SIM Card,PUSH PULL,H1.7mm Boitsebiso ba Odara:KLS1-SIM-015B-H1.7-RPins:6pinsHeight:H1.7mmR=Roll pack

Sehokelo sa 6P SIM Card,PUSH PULL,H2.2mm H2.7mm H2.9mm KLS1-SIM-015

Lintlha tsa Sehlahisoa Tlhahisoleseling ea Sehlahisoa 6P SIM Card Connector,PUSH PULL,Roll pack,H2.0mm,H2.2mm,H2.7mm,H2.9mm Boitsebiso ba Odara: KLS1-SIM-015-6P-H2.7 Pins:6pins Height:H2.2mm,H2.7mm,H2.9mm Material: Matlo:Hi-Temp.Plastic,UL94V-0.Black. Theminale: Alloy ea Koporo,(T=0.15mm), Khauta e Patiloeng Holima Nickel. Fork: Alloy ea Koporo,(T=0.20mm), Tin e Paliloeng ka Nikelo. Motlakase: Boemo ba Hona Joale: 1.0 A max. Khokahano ea ho Kopana: 30mΩ Max. Dielectric Withstanding Voltage: 500V AC RMS Bakeng sa Motsotso o le Mong. Insulation Resis ...

Sehokelo sa SIM Card;PUSH PULL,6P+2P,H3.0mm KLS1-SIM-C727-2

Litšoantšo tsa Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card;PUSH PULL,6P+2P,H3.0mm,Roll pack. Material: Base:Hi Temp Thermoplastic,Black UL94V-0 Cover:Stainless Steel Data Contact:Copper Alloy,Gold plated Switch Contact 1:Copper Alloy,Gold plated Switch Contact 2:Copper Alloy,Gold plated General Characteristics Dimensions:15.85L*16.0000HW *16.50HW * Weightx:0000HW 0.78%%P0.2g Durability:5000 cycles min. Khahlano ea ho Kopana le Litšobotsi tsa Motlakase: 50mΩ e tloaelehileng 100mΩ Max. Insulation Resistanc...

Sehokelo sa 6P SIM Card Mofuta o hinged,H1.8mm KLS1-SIM-018A

Litšoantšo tsa Sehlahisoa Tlhahisoleseding ea Sehlahisoa 6P SIM Card Connector Hinged type,H1.8mm Tlhahisoleseding ea Odara: KLS1-SIM-018A-6P-H1.8-R Pins:6pins H1.8=Bophahamo 1.8mm R=Roll pack NOTE: 1.0 RATING. 1.1 VOLTAGE:12 VAC (rms) 1.2 HONA JOALE: 1 AMPERES MAX. MOTHO OA MONG LE O MONG O MONG OA MOTLATSI: 2.1 KHANYETSO EA TSE KHABANE:60mΩ 2.2 HO FIHLELA HO FIHLELA HO FIHLELA: 1000MΩ 2.3 DIELECTRIC E TSAMAEA VOLTAGE:500V AC FOR 1 MINUTE 3:0 5 OPERATION 4000. Mocheso: -45ºC ~+105ºC

6P

Litšoantšo tsa Sehlahisoa