Sehokelo sa Micro SIM Card,8P
Sehokelo sa Micro SIM Card,8P
Sehokelo sa Micro SIM Card, 6P
P-H1.5-R )
Sehokelo sa Micro SIM Card;PUSH PUSH,6P+1P Kapa 8P+1P,H1.50mm KLS1-SIM-090
Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm KLS1-SIM-069
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card;PUSH PUSH,6P Kapa 6P+1P,H1.35mm, Ntle le poso. Boitsebiso: Insulator:High TemperatureThermoplastic,UL94V-0 Contact: Copper Alloy,Plated 50U" NiOverall Contact Au 1U Shell:SUS,Plated 50U" Ni Overall Plated 1u"Au Selective Contact Area Electrical: Current Rating: 0.5A Max. Insulation Resistance:1000M Min./500VDC Ambient Humidity Range:95% RH Ma...
Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm KLS1-SIM-044-8P
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card 8P,PUSH PULL,H2.4mm Boitsebiso: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Khokahano ea Boitsebiso: Copper Alloy, Gold Plated. Shell:Stainless Steel,Gold Plated. Motlakase: Khahlano ea ho Kopana: 50mΩ e tloaelehileng, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Mohato oa Mouoane:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ho soasoa ka letsoho: 370ºC.3sec.Max. Mocheso oa ho sebetsa: -45ºC~+105&o...
Sehokelo sa Micro SIM Card 6P,PUSH PULL,H2.4mm KLS1-SIM-044-6P
Tlhahisoleseding ea Sehlahisoa Sehokelo sa Micro SIM Card 6P,PUSH PULL,H2.4mm Boitsebiso: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Khokahano ea Boitsebiso: Copper Alloy, Gold Plated. Shell:Stainless Steel,Gold Plated. Motlakase: Khahlano ea ho Kopana: 50mΩ e tloaelehileng, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Mohato oa Mouoane:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ho soasoa ka letsoho: 370ºC.3sec.Max. Mocheso oa ho sebetsa: -45ºC~+105&o...
Sehokelo sa SIM Card;PUSH PUSH,6P+2P,H1.80mm,Ka poso kapa Ntle le poso. KLS1-SIM-110
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card;PUSH PUSH,6P+2P,H1.80mm Ka poso kapa Ntle le poso.Material: Material ea Ntlo: LCP UL94V-0Contact Material: Tin-BronzePackage: Theipi le Reel PackageLitšobotsi tsa Motlakase: Tekanyetso ea Voltage: 100VV rating 250V AC/1MinuteInsulation resistance: ≥1000ΜΩHo hanyetsana le: ≤30mΩBophelo:
Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.9mm,ka Post KLS1-SIM-108
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.9mm,ka poso Material: Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: Alloy ea koporo. Plating: Sebaka sa Kopano: Khauta ea flash. Sebaka sa Solder: 80u" Min, Matte tin alloy plated. Tlas'a poleiti: 30u "min, Nickel. Shell:30u" Min,Nickel plated generalSebaka sa Solder:Gole flash.Motlakase: Tekanyetso ea Hona joale:0.5A. Ho mamella Voltage:AC500V rms Insulation Resistance:1000MΩMin,At DC 500V ...
Sehokelo sa SIM Card,PUSH PUSH,6P+1P,H1.9mm,ka Post KLS1-SIM-107
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P+1P,H1.9mm,e nang le Boitsebiso ba Post: Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: Alloy ea koporo / tšepe. Plating: Sebaka sa Kopano: Khauta ea flash. Sebaka sa Solder: 80u" Min, Matte tin alloy plated. Tlas'a poleiti: 30u "min, Nickel. Shell:30u" Min,Nickel plated general area Solder:Gole flash.Motlakase: Tekanyetso ea Hona Joale:0.5A. Withstanding Voltage:AC500V rms Insulation Resistance:1000MΩMin,At...
Sehokelo sa SIM Card;PUSH PUSH,6P,H1.85mm KLS1-SIM-106
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm,e nang le Post Housing:Hi-Temp Plastic,UL94V-0.Rated. Kopana le: Copper Alloy. Shell: SUS. Qetella: Khauta e pentiloeng sebakeng sa conatct, Tin e kentsoeng mehatleng ea solder. Karolo ea No. Tlhaloso PCS/CTN GW(KG) CMB(m3) OrderQty. Taelo ya Nako
Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Post KLS1-SIM-087
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated ho Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash on Solder Latch. Motlakase: Current Rating:0.5A. Voltage Rating:5.0 Vrms. Insulation Resist...
Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Post KLS1-SIM-086
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated ho Allover,GoldPlating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel e kentsoe ka tlas'a Allover,Gold Flash onSolder Latch.Motlakase: Boemo ba Hona Joale:0.5A. Voltage Rating:5.0 Vrms. Insulation Resis...
Sehokelo sa SIM Card,PUSH PUSH,8P+2P,H1.85mm, ntle le Post KLS1-SIM-085A
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,8P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-TemperaturePlastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u" Nickel e kentsoe ka tlas'a Allover,GoldFlash on Solder Latch.Motlakase: Tekanyetso ea Hona Joale:0.5A. Voltage Rating:5.0 Vrms. Insulation Resist...
Sehokelo sa SIM Card,PUSH PUSH,8P+2P,H1.85mm, ntle le Post KLS1-SIM-085
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,8P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated onAllover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,GoldFlash on Solder Latch.Motlakase: Hajoale Rating:0.5A. Voltage Rating:5.0 Vrms. Insulation Resi...
Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Post KLS1-SIM-084
Tlhahisoleseding ya Sehlahiswa Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm,ntle le Sesebediswa sa Poso: Bolulo:LCP,UL94V-0 Contact:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester.OperatingFlashºCtemperature:+5OperatingFºGold Finish:+5OperatingFºGold Mocheso: Sebaka;Gold Flash Plated On SolderTails,Ka Kopana Kahohle Ka tlase ho 50u" min Nickel. Shell:50u" min Nickel e Tlatselitsoe Ka Kakaretso, Khauta e Nang le Mehatla e Solder. Karolo ea No. Tlhaloso PC...
Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm,ntle le Post KLS1-SIM-074B
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm, ntle le Boitsebiso ba Post: Bolulo:Mocheso o Phahameng Thermoplastic,UL94V-0.Black. Kopana le: Copper Alloy. Sekoahelo:Ikopanye: Li-alloys tsa Koporo Kapa Tšepe. Plating: Underplate:Nickel. Sebaka sa Kopano: Gold Over Nickel. Sebaka sa Solder: Tin Over Nickel. Shell:G/F Plate Over Nickel On Solder Tails Motlakase: Boemo ba Hona Joale:0.5A. Tekanyo ea matla: 5.0 Vrms. Insulation Resistance: 500M Min.At DC 500V DC E mamella Voltage: 250V A...
Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm, ntle le Post KLS1-SIM-074A
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,8P+1P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-TemperaturePlastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u" Nickel e kentsoe ka tlas'a Allover,GoldFlash on Solder Latch.Motlakase: Hajoale Rating:0.5A. Voltage Rating:5.0 Vrms. Insulation Resistanc...
Sehokelo sa SIM Card, PUSH PUSH,6P,H1.85mm, e nang le Post and out Post KLS1-SIM-073A
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P,H1.85mm, ka Post and out Post Motlakase: Tekanyetso ea Hona Joale: 0.5A. Tekanyo ea matla: 5.0 Vrms. Insulation Resistance: 500M Min.At DC 500V DC Withstanding Voltage: 250V ACrms Bakeng sa 1 Motsotso. Kopana le Khanyetso: 100M Max.At 10MA/20mVMAX. Mocheso oa ho sebetsa: -45ºC~+85ºCMatingCycles:5000 Insertions. Lintho tse bonahalang: Insulator: H-Temperature Plastic, UL94V-0.Black. Khokahano: Alloy ea Koporo,T=0.15mm Shell:Stainless Steel,T=0.15...
Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Post KLS1-SIM-064A
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm, ntle le Boitsebiso ba Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flashon Solder Latch.Motlakase: Hajoale Rating:0.5A. Voltage Rating:5.0 Vrms. Insulation Resist...
Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.80mm,ntle le Post KLS1-SIM-030C
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.80mm, ntle le Boitsebiso ba poso: Bolulo: LCP,UL94V-0 Contact:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester. Qetella: Kopana le: Khauta e Platiloeng ka Khauta sebakeng sa Khokahano; Khauta e Pelletsoe Mehatleng e Solder, Ka Kopana ka ho FetisisaUnderplated 50u" min Nickel. Shell: 50u" min Nickel Underplated Overall, GoldFlash Plated On Solder Tails.Mocheso oa ho sebetsa: -45ºC~+85ºC Karolo ea No.
Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm,ka Post KLS1-SIM-030D
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P+2P,H1.85mm, ka Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm;Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated ho Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash on Solder Latch. Motlakase: Current Rating:0.5AVoltage Rating:5.0 Vrms. Insulation Resistance...
Sehokelo sa SIM Card,PUSH PUSH,6P+2P,H1.85mm,ka Post KLS1-SIM-030F
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P+2P,H1.85mm, ka Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Kopana le: Copper Alloy,T=0.15mm;Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel e Underplated ho Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash on Solder Latch. Motlakase: Current Rating:0.5AVoltage Rating:5.0 Vrms. Insulation Resistance...
Sehokelo sa SIM Card,PUSH PUSH,6P,H1.85mm, ntle le Post KLS1-SIM-030E
Tlhahisoleseding ea Sehlahisoa Sehokelo sa SIM Card, PUSH PUSH,6P,H1.85mm, ntle le Boitsebiso ba Post: Housing: Hi-Temp Plastic, UL94V-0.Rated. Kopana le: Copper Alloy. Shell:Stainless Steel.SUS 301,T=0.20mm. Plating: Sebaka sa ho kopana: G / F E entsoe ka 30u "Sebaka sa Nickel Solder: 80u" Tin Plated ho feta 30u "Nickel. Tlas'a poleiti: 30u" Min Nickel. Shell:30u" Min,Nickel Plated Over All,SolderArea:Gold Flash.Motlakase: Current Rating:0.5 A Dielectric Withstanding Voltage:250...- English
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